Control of the Sediment in a Combined Sewer Using a Separation Wall
Lim, Bong Su, Kwon, Chung Jin, Kim, Do Young, Lee, Kuang Chun
Published in Environmental engineering research (2013)
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Published in Environmental engineering research (2013)
Journal Article
Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages
Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Shyue-Ter Leu, Shin-Puu Jeng
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
An Integrated Warpage Prediction Model Based on Chemical Shrinkage and Viscoelasticity for Molded Underfill
Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Fan-out wafer molding process optimization using cure-dependent viscoelastic modeling and characterizations
Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages
Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Lidded FCCSP warpage evaluation: Process modeling and characterization of the effect of viscoelasticity and cured shrinkage for molded underfill
Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Ming-Chih Yew, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Shyue-Ter Leu
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Characterization methodologies for copper/polymer interfacial strength
Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
A novel integrated warpage prediction model based on characterization of viscoelasticity in time domain and chemical shrinkage for molded underfill
Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Ming-Chih Yew, Kuang-Chun Lee, Shyue-Ter Leu, Kuo-Chuan Liu
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
CHIP PACKAGE STRUCTURE WITH RING STRUCTURE AND METHOD FOR FORMING THE SAME
LIN YI HANG, LIN PO YAO, LAI PO CHEN, LEE KUANG CHUN, WANG CHIN HUA, YEH SHU SHEN, YANG CHE CHIA, JENG SHIN PUU
Year of Publication 21.07.2021
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Year of Publication 21.07.2021
Patent
Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process
Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Hsu, Chia-Kuei, Yang, Che-Chia, Liao, Li-Ling, Lin, Yu-Sheng, Jeng, Shin-Puu
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
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Conference Proceeding
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
Cheng, Ming-Da, Chen, Chen-Shien, Kao, Chin-Fu, Lee, Kuang-Chun, Zhan, Kai Jun
Year of Publication 01.08.2024
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Year of Publication 01.08.2024
Patent
Semiconductor device package and methods of manufacture
Cheng, Ming-Da, Chen, Chen-Shien, Kao, Chin-Fu, Lee, Kuang-Chun, Zhan, Kai Jun
Year of Publication 07.05.2024
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Year of Publication 07.05.2024
Patent
Integrated Circuit Packages and Methods of Forming the Same
Li, Chien-Chen, Liu, Kuo-Chio, Kuo, Chien-Li, Lin, Wen-Yi, Lee, Kuang-Chun
Year of Publication 29.02.2024
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Year of Publication 29.02.2024
Patent
Semiconductor Device and Method Forming Same
Li, Chien-Chen, Liu, Kuo-Chio, Kuo, Chien-Li, Lin, Wen-Yi, Lee, Kuang-Chun
Year of Publication 21.12.2023
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Year of Publication 21.12.2023
Patent
Semiconductor Device and Method Forming Same
Li, Chien-Chen, Liu, Kuo-Chio, Kuo, Chien-Li, Lin, Wen-Yi, Lee, Kuang-Chun
Year of Publication 07.12.2023
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Year of Publication 07.12.2023
Patent
Dummy through vias for Integrated Circuit Packages and Methods of Forming the Same
Li, Chien-Chen, Liu, Kuo-Chio, Kuo, Chien-Li, Lin, Wen-Yi, Lee, Kuang-Chun
Year of Publication 23.11.2023
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Year of Publication 23.11.2023
Patent
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION AND METHODS OF FORMING THE SAME
LEE, Kuang-Chun, LI, Chien-Chen, LIU, Kuo-Chio, KUO, Chien-Li, LIN, Wen-Yi
Year of Publication 29.08.2024
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Year of Publication 29.08.2024
Patent
CHIP PACKAGE WITH LID
LIN, Po-Yao, LEE, Kuang-Chun, YEH, Shu-Shen, WANG, Chin-Hua, LEU, Shyue-Ter, JENG, Shin-Puu
Year of Publication 11.04.2024
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Year of Publication 11.04.2024
Patent