Study of Board Level Reliability of eWLB (embedded Wafer Level BGA) for 0.35mm Ball Pitch
Lee, Kang Hai, Lim, Yeow Kheng, Chow, Seng Guan, Chen, Kang, Choi, Won Kyung, Yoon, Seung Wook, Liu, N.W., Chi, Yenyao, Lin, Benson
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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