A new innovative model for green QFN qualification
Jeffrey, ChangBing Lee, Chang, Graver, Chen, Cherie, ChengChih Chen, Lin, Jandel
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
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Conference Proceeding
Method of Triple Thin Film RDL Layers on 2.2D Substrate
Chen, Er-Hao, Hu, Dyi-Chung, Lee, Jeffrey ChangBing
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
A Novel Modelling Methodology for Underfill Molding Process On 2.2D Heterogeneous Integrated Substrate
Liang, Yu En, Sun, Chia Peng, Hsu, Chih Chung, Hu, Dyi Chung, Chen, Er Hao, Lee, Jeffrey Changbing
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26.10.2022)
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26.10.2022)
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Conference Proceeding
A Novel Equivalent Model for Underfill Molding Process On 2.2D Structure for High Performance Applications
Liang, Yu En, Sun, Chia Peng, Hsu, Chih Chung, Hu, Dyi Chung, Chen, Er Hao, Lee, Jeffrey Changbing
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
In-situ Observation of Underfill Dispensing Process
Hu, Dyi Chung, Hao Chen, Erh, Lee, Jeffrey ChangBing, Peng Sun, Chia, Liang, Yu En
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
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Conference Proceeding
2.2D Die last Integrated Substrate for High Performance Applications
Hu, Dyi Chung, Chen, Er Hao, Lee, Jeffrey ChangBing, Sun, Chia Peng, Hsu, Chih Chung
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Moisture Effect on Physical Failure of Plastic Molded SiP Module
Lee, Jeffrey ChangBing, Chen, Cheng-Chih, Lee, Dem, Chen, Jess
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Optimization of 2.2D Underfill Process by Novel Methodology and Direct Observation of Capillary Underfill Process
Sun, Chia-Peng, Liang, Yu-En, Hu, Dyi-Chung, Chen, Er-Hao, Lee, Jeffrey ChangBing, Vallury, Srikar
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
The Novel Failure Mechanism of the Polymer Ball Interconnected CBGA under Board Level Thermal Mechanical Stress
Lee, Jeffrey ChangBing, Chen, Cheng-Chih, Lee, Dem, Chen, Cherie, Lin, Alice
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
A Strain Controllable Board Level Bending Method for PoP Package Reliability Validation
Lee, Jeffrey ChangBing, Chen, Cheng-Chih, Brown, Lane, Mehretu, Esme, Obrien, Thomas, Lu, Feng
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding
A Dynamic Bending Method for PoP Package Board Level Reliability Validation
Lee, Jeffrey, Cheng-Chih Chen, Brown, Lane, Mehretu, Esme, Obrien, Thomas, Feng Lu
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
The failure mechanism investigation of the polymer ball interconnected CBGA under board level thermal mechanical stress
Lee, Jeffrey ChangBing, Cheng-Chih Chen, Dem Lee, Lin, Alice
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Methodology development for counterfeit component mitigation
Huehne, Martin, Lee, Jeffrey ChangBing, Miles, Harrison, Schaffer, Mark
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
The green material effect on the board level reliability qualification of QFN packages
Lee, Jeffrey ChangBing, Li Li, Smith, Brian
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
The effect of the pre-treatment of metal foil on Sulfur's Corrosive Reaction Rate in Flower of Sulfur test
Dem Lee, Cheng Chih Chen, Lee, Jeffrey ChangBing, Liou, Peggy
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
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Conference Proceeding
Shock resistant and thermally reliable low Ag SAC solder doped with Mn
Goudarzi, Vahid, Brown, Matthew, Weiping Liu, Ning-Cheng Lee, Lee, Jeffrey ChangBing
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
The methodology to monitor gaseous contamination in data centers
Lee, Dem, Lee, Jeffrey ChangBing, Cheng Chih Chen, Chang, Graver, Lin, Jandel
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
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Conference Proceeding
Ion bombardment methodology for lead free solder microstructure characterization
Cheng-Chih Chen, Lee, Jeffrey ChangBing, Hung-Chieh Lin, Yu-Hsien Chang, Lee, Dem, Liou, Peggy
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
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Conference Proceeding