Evaluation of electromigration (EM) life of ENEPIG and CuSOP surface finishes with various solder bump materials
Dong Wook Kim, Lee, J K Jerry, Myung-June Lee, Pai, S Y, Chen, Stan, Kuo, Frank
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Component and system effective lifetime & FIT model in advanced technology
Lee, J. K. Jerry, Haggag, Amr
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
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Conference Proceeding
Protecting against emerging vmin failures in advanced technology nodes
Lee, J. K. Jerry, Haggag, Amr, Eklow, William
Published in 2014 International Test Conference (01.10.2014)
Published in 2014 International Test Conference (01.10.2014)
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Conference Proceeding
Mitigating "No trouble found" component returns
Haggag, A., Sumikawa, N., Shaukat, A., Lee, J. K. Jerry, Aghel, Nick, Slayman, Charlie
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Impact of VLSI scaling on die qualification
Haggag, Amr, Phillips, Michael, Lee, J. K. Jerry
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
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Conference Proceeding
Product dielectric reliability
Lee, J. K. J., Pai, S. Y., Chang, K. P., Hsu, N., Juan, A., Su, K. C.
Published in 2011 IEEE International Integrated Reliability Workshop Final Report (01.10.2011)
Published in 2011 IEEE International Integrated Reliability Workshop Final Report (01.10.2011)
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Conference Proceeding
Reliability framework in a fabless-foundry environment
Pai, S.Y., Lee, J.K.J., Ng, K., Hsiao, R., Su, K.C., Chou, E.N.
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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Conference Proceeding
Effect of adatom mobility and substrate finish on film morphology and porosity: thin chromium film on hard disk
Chia, Ray W.J, Wang, Charles C, Lee, Jerry J.K
Published in Journal of magnetism and magnetic materials (01.02.2000)
Published in Journal of magnetism and magnetic materials (01.02.2000)
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Journal Article
Conference Proceeding