Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps
Chen, Chiao-Wen, Chiu, Tsung-Chieh, Chiu, Ying-Ta, Lee, Chiu-Wen, Lin, Kwang-Lung
Published in Intermetallics (01.06.2017)
Published in Intermetallics (01.06.2017)
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Journal Article
Silane modification on mesoporous silica coated carbon nanotubes for improving compatibility and dispersity in epoxy matrices
Chung, Min-Hua, Wang, Wei-Hsiang, Chen, Li-Ming, Lee, Chiu-Wen, Yang, Ping-Feng, Liao, Yen-Sen, Lin, Hong-Ping
Published in Composites. Part A, Applied science and manufacturing (01.11.2015)
Published in Composites. Part A, Applied science and manufacturing (01.11.2015)
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Journal Article
Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process
Wei-Chung Chen, Chiu-Wen Lee, Hung-Chun Kuo, Min-Hua Chung, Chaung-Chi Wang, Shang-Kun Huang, Yen-Sen Liao, Chen-Chao Wang, Tarng, David
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Novel ultra-fine line 2.1D package with organic interposer
Wei-Chung Chen, Chiu-Wen Lee, Min-Hua Chung, Chuang-Chi Wang, Shang-Kun Huang, Yen-Sen Liao
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
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Conference Proceeding
Novel copper surface preparation processes for copper alloy lead frame lamination pretreatment in embedded packaging device
Wei-Chung Chen, Chiu-Wen Lee, Lu-Fu Lin, Yen-Fu Liu, Hau Cheng, Te-Jung Hsu, Kun-Ting Tsai, Ming-Hung Chen, Tang-Yuan Chen, Pin-Feng Yang, Uegaki, Shoji, Chih-Pin Hung
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Electromigration reliability and morphologies of Cu pillar flip-chip solder joints
Yi-Shao Lai, Ying-Ta Chiu, Chiu-Wen Lee, Yu-Hsiu Shao, Jiunn Chen
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Development of novel fine line 2.1 D package with organic interposer using advanced substrate-based process
Chen, Wei-Chung, Lee, Chiu-Wen, Kuo, Hung-Chun, Wang, Chen-Chao, Tarng, David
Published in 2018 IEEE CPMT Symposium Japan (ICSJ) (01.11.2018)
Published in 2018 IEEE CPMT Symposium Japan (ICSJ) (01.11.2018)
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Conference Proceeding
The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing
Chiao-Wen Chen, Kwang-Lung Lin, Ying-Ta Chiu, Chin-Li Kao, Chiu-Wen Lee, Ping-Feng Yang
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Investigation of mesoporous silica coated multi-wall carbon nanotubes on the mechanical and thermal properties of epoxy nanocomposites
Min-Hua Chung, Ping-Feng Yang, Chiu-Wen Lee, Chih-Ping Hung, Hong-Ping Lin
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
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Conference Proceeding
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS XI
HSIAO, Yu-Hsiang, LIN, Kwang-Lung, LEE, Chiu-Wen, SHAO, Yu-Hsiu, LAI, Yi-Shao
Published in Journal of electronic materials (2012)
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Published in Journal of electronic materials (2012)
Journal Article
Interfacial behavior between copper foil and tin upon thermal aging
Chiu-Wen Lee, Shih-Ming Kuo, Kwang-Lung Lin
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
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Conference Proceeding
Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages
Yi-Shao Lai, Sathe, S., Chin-Li Kao, Chiu-Wen Lee
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding