Mechanical and Thermal Characterization of TSV Multi-chip Stacked Packages for Reliable 3D IC Applications
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Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
FOAMABLE RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND MOLDED FOAM PRODUCT
KIM, Sung Hun, SHIN, Hwan Ho, LEE, Byeong Do, AHN, Jun Hwan, KIM, Dong Hee
Year of Publication 05.12.2019
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Year of Publication 05.12.2019
Patent
EXPANDABLE RESIN COMPOSITION METHOD FOR PREPARING THE SAME AND FOAMED MOLDED ARTICLE
AHN JUN HWAN, KIM DONG HEE, KIM SUNG HUN, LEE BYEONG DO, SHIN HWAN HO
Year of Publication 09.12.2019
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Year of Publication 09.12.2019
Patent
A case of postcardiac injury syndrome presenting as acute mediastinitis
Lim, Hong-Kyu, Bae, Young-Phil, Lee, Byeong-Do, Kim, Bong-Gun, Park, Jong-Hwa, Kim, Jun-Hyung, Jang, Jae-Sik
Published in Korean circulation journal (01.07.2009)
Published in Korean circulation journal (01.07.2009)
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Journal Article