The 419th Aspartic Acid of Neural Membrane Protein Enolase 2 Is a Key Residue Involved in the Axonal Growth of Motor Neurons Mediated by Interaction between Enolase 2 Receptor and Extracellular Pgk1 Ligand
Lee, Bing-Chang, Tsai, Jui-Che, Huang, Yi-Hsin, Wang, Chun-Cheng, Lee, Hung-Chieh, Tsai, Huai-Jen
Published in International journal of molecular sciences (01.10.2024)
Published in International journal of molecular sciences (01.10.2024)
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Journal Article
High antimicrobial activity of lactoferricin‐expressing Bacillus subtilis strains
Lee, Bing‐Chang, Tsai, Jui‐Che, Hung, Chun‐Wei, Lin, Cheng‐Yung, Sheu, Jin‐Chuan, Tsai, Huai‐Jen
Published in Microbial biotechnology (01.06.2022)
Published in Microbial biotechnology (01.06.2022)
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Journal Article
Oral administration of transgenic biosafe microorganism containing antimicrobial peptide enhances the survival of tilapia fry infected bacterial pathogen
Lee, Bing-Chang, Hung, Chun-Wei, Lin, Cheng-Yung, Shih, Chen-Han, Tsai, Huai-Jen
Published in Fish & shellfish immunology (01.12.2019)
Published in Fish & shellfish immunology (01.12.2019)
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Journal Article
Characterization of random glass fiber-reinforced polypropylene for processing
Wu, Tzong-Ming, Chiang, Chih-Cheng, Chung, Chia-Tin, Lee, Chang-Bing, Hou, Chun-Chen
Published in Journal of polymer research (01.10.1996)
Published in Journal of polymer research (01.10.1996)
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Journal Article
Board level validation for green IC packaging with strain-controllable dynamic bending method
Lee, Jeffrey Chang-Bing, Chi-Ko Yu, Chang, Graver, Shao, Tina, Chen, Cherie, Xiang-Kai Meng, Brown, Matt
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
2.2D Die last Integrated Substrate for High Performance Applications
Hu, Dyi Chung, Chen, Er Hao, Lee, Jeffrey ChangBing, Sun, Chia Peng, Hsu, Chih Chung
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Moisture Effect on Physical Failure of Plastic Molded SiP Module
Lee, Jeffrey ChangBing, Chen, Cheng-Chih, Lee, Dem, Chen, Jess
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Optimization of 2.2D Underfill Process by Novel Methodology and Direct Observation of Capillary Underfill Process
Sun, Chia-Peng, Liang, Yu-En, Hu, Dyi-Chung, Chen, Er-Hao, Lee, Jeffrey ChangBing, Vallury, Srikar
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
A new innovative model for green QFN qualification
Jeffrey, ChangBing Lee, Chang, Graver, Chen, Cherie, ChengChih Chen, Lin, Jandel
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
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Conference Proceeding
The methodology to monitor gaseous contamination in data centers
Lee, Dem, Lee, Jeffrey ChangBing, Cheng Chih Chen, Chang, Graver, Lin, Jandel
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
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Conference Proceeding