by Yung, K.C., Law, C.M.T., Lee, C.P., Cheung, B., Yue, T.M.
Published in Journal of electronic materials (01.02.2012)

by Wu, C.M.L., Yu, D.Q., Law, C.M.T., Wang, L.
Published in Materials science & engineering. R, Reports : a review journal (01.04.2004)

by Yu, D.Q., Wu, C.M.L., Law, C.M.T., Wang, L., Lai, J.K.L.
Published in Journal of alloys and compounds (19.04.2005)

by Yu, D.Q., Wang, L., Wu, C.M.L., Law, C.M.T.
Published in Journal of alloys and compounds (08.03.2005)

by Law, C.M.T., Wu, C.M.L., Yu, D.Q., Li, M., Chi, D.Z.
Published in IEEE transactions on advanced packaging (01.05.2005)

by Yu, D.Q., Wang, L., Wu, C.M.L., Law, C.M.T.
Published in Journal of alloys and compounds (2005)

by Law, C.M.T., Wu, C.M.L.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Wu, C.M.L., Law, C.M.T.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)