Panel molded electronic assemblies with multi-surface conductive contacts
Kirk, Jeffery J, Mutter, Rudolph F, D'Amico, Andrew T, Lavery, Patrick R, Vinciarelli, Patrizio
Year of Publication 17.09.2024
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Year of Publication 17.09.2024
Patent
Panel molded electronic assemblies with multi-surface conductive contacts
Kirk, Jeffery J, Mutter, Rudolph F, D'Amico, Andrew T, Lavery, Patrick R, Vinciarelli, Patrizio
Year of Publication 03.05.2022
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Year of Publication 03.05.2022
Patent
Methods of forming modular assemblies
Kirk, Jeffery J, Mutter, Rudolph F, D'Amico, Andrew T, Lavery, Patrick R, Vinciarelli, Patrizio
Year of Publication 14.01.2020
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Year of Publication 14.01.2020
Patent
Method of electrically interconnecting circuit assemblies
Kirk, Jeffery J, Mutter, Rudolph F, D'Amico, Andrew T, Lavery, Patrick R, Vinciarelli, Patrizio
Year of Publication 16.04.2019
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Year of Publication 16.04.2019
Patent
Creep and tensile behavior of lead-rich lead-tin solder alloys
Frost, H.J., Howard, R.T., Lavery, P.R., Lutender, S.D.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1988)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1988)
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Journal Article