A novel method to predict die shift during compression molding in embedded wafer level package
Chee Houe Khong, Kumar, A., Xiaowu Zhang, Sharma, G., Vempati, S.R., Vaidyanathan, K., Lau, J.H.-S., Dim-Lee Kwong
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Development of Optical Subassembly for Plastic Optical Fiber Transceiver in High-Speed Applications
Jing Zhang, Ramana, Pamidighantam V, Chandrappan, Jayakrishnan, Chee Wei Tan, Yi Yoon Chai, Yee Mong Khoo, Wei Liang Teo, Shing, John Lau Hon, Gomex, Philbert Oliver, Ting Wang, Ramkumar, V M
Published in IEEE transactions on advanced packaging (01.05.2010)
Published in IEEE transactions on advanced packaging (01.05.2010)
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Journal Article
Design and Characterization of Taper Coupler for Effective Laser and Single-Mode Fiber Coupling With Large Tolerance
Zhang Jing, Ramana, P.V., Hon-Shing, J.L., Zhang Qingxin, Chandrappan, J., Tan Chee Wei, Jong Ming Chinq, Liang, C., Kwong Dim Lee
Published in IEEE photonics technology letters (15.08.2008)
Published in IEEE photonics technology letters (15.08.2008)
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Journal Article
PACKAGE STRUCTURE
Lin, Pu-Ju, Lau, John Hon-Shing, Ko, Cheng-Ta, Tseng, Tzyy-Jang, Yang, Kai-Ming, Lin, Chen-Hao
Year of Publication 25.07.2024
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Year of Publication 25.07.2024
Patent
CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE
Lau, John Hon-Shing, Ko, Cheng-Ta, Tseng, Tzyy-Jang, Tain, Ra-Min, Chien, Chun-Hsien
Year of Publication 04.05.2023
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Year of Publication 04.05.2023
Patent
Circuit board structure and manufacturing method thereof
Lee, Shao-Chien, Lau, John Hon-Shing, Cheng, Chen-Hua, Tseng, Tzyy-Jang, Tain, Ra-Min
Year of Publication 27.12.2022
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Year of Publication 27.12.2022
Patent