A novel method to predict die shift during compression molding in embedded wafer level package
Chee Houe Khong, Kumar, A., Xiaowu Zhang, Sharma, G., Vempati, S.R., Vaidyanathan, K., Lau, J.H.-S., Dim-Lee Kwong
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Get full text
Conference Proceeding