Is the adsorption of soil organic matter to haematite (α‐Fe2O3) temperature dependent?
Nguyen, M. L., Hockaday, W. C., Lau, B. L. T.
Published in European journal of soil science (01.09.2018)
Published in European journal of soil science (01.09.2018)
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Journal Article
Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers
Heng Yun Zhang, Xiao Wu Zhang, Lau, B. L., Lim, Sharon, Liang Ding, Yu, M. B.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2014)
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Journal Article
Fan-Out Wafer Level Packaging Development Line
TC, Chai, Ho, David, SC, Chong, HY, Hsiao, Soh, Serine, Lim, Simon, PS, Sharon Lim, Wai, Eva, BL, Lau, WW, Seit, GK, Lau, TS, Phua, Lim, Keith, SH, Sharon Lim, YL, Ye
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
Sorption temperature and the stability of iron-bound soil organic matter
Nguyen, M.L., Goldfarb, J.L., Plante, A.F., Lau, B.L.T., Hockaday, W.C.
Published in Geoderma (01.05.2019)
Published in Geoderma (01.05.2019)
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Journal Article
Thermal characterization and simulation study of 2.5D packages with multi-chip module on through silicon interposer
Zhang, H. Y., Zhang, X. W., Lau, B. L., Lim, Sharon, Liang Ding, Yu, M. B., Lee, Y. J.
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Development of package level hybrid silicon heat sink for hotspots cooling
Lau, B. L., Lee, Y. J., Yong Han, Leong, Y. C., Choo, K. F., Xiaowu Zhang, Chan, P. K.
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Psychological symptoms among healthcare workers handling COVID-19 patients
Sim, S K, Lau, B L, Zaila, S R, Hazira, N, Aniqah, N M, Panicker, J, Hamzah, A S
Published in Medical journal of Malaysia (01.03.2021)
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Published in Medical journal of Malaysia (01.03.2021)
Journal Article
Comparing the outcome of monitored anaesthesia care and local anaesthesia for carpal tunnel syndrome surgery by neurosurgeons
Goh, C H, Lau, B L, Teong, S Y, Law, W C, Tan, C S, Vasu, R, Liew, D
Published in Medical journal of Malaysia (01.12.2019)
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Published in Medical journal of Malaysia (01.12.2019)
Journal Article
Brain and spinal tumour
Goh, C H, Lu, Y Y, Lau, B L, Oy, J, Lee, H K, Liew, D, Wong, A
Published in Medical journal of Malaysia (01.12.2014)
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Published in Medical journal of Malaysia (01.12.2014)
Journal Article
Removal of nano and microparticles by granular filter media coated with nanoporous aluminium oxide
Lau, B L T, Harrington, G W, Anderson, M A, Tejedor, I
Published in Water Science & Technology (01.01.2004)
Published in Water Science & Technology (01.01.2004)
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Journal Article
Conference Proceeding
Study of dielectric materials coating conformality and adhesiveness on epoxy mold compound surface
Lau, B. L., Ho, David, Hsiao, H. Y., Yamamoto, K.
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Development of fluxless bonding using deposited Gold-indium multi-layer composite for heterogeneous silicon micro-cooler stacking
Lau, B. L., Yong Han, Zhang, H. Y., Zhang, L., Zhang, X. W.
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Fabrication of package level silicon micro-cooler for electronics cooling
Lau, B. L., Yong Han, Gong Yue, Zhang Lu, Zhang Xiaowu
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Development of thermal test chip for GaN-on-Si device hotspot characterization
Lau, B. L., Lee, Y. J., Leong, Y. C., Choo, K. F., Zhang, X., Chan, P. K.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding