Search Results - "Langari, Abdolreza" :: K.UTB vyhledávací portál

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고속 애플리케이션 패키지들용 감지 라인들

by PATIL ANIKET, LI YUAN, LANGARI ABDOLREZA, WE HONG BOK, ZHANG LISHA
Year of Publication 13.03.2024

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INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING

by SHAH, Milind, LANGARI, Abdolreza, KIM, Jonghae, CHIDAMBARAM, Periannan
Year of Publication 17.08.2023

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Integrated circuit assembly with hybrid bonding

by Shah, Milind, Langari, Abdolreza, Kim, Jonghae, Chidambaram, Periannan
Year of Publication 06.06.2023

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SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES

by LI, Yuan, PATIL, Aniket, LANGARI, Abdolreza, ZHANG, Lisha, WE, Hong Bok
Year of Publication 05.06.2024

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INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING

by SHAH, Milind, LANGARI, Abdolreza, KIM, Jonghae, CHIDAMBARAM, Periannan
Year of Publication 07.04.2022

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INTEGRATED PASSIVE DEVICE (IPD) COUPLED TO FRONT SIDE OF INTEGRATED DEVICE

by LANGARI, Abdolreza, KIM, Jonghae, ZHANG, Lisha, CHIDAMBARAM, Periannan
Year of Publication 08.07.2021

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SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES

by LI, Yuan, PATIL, Aniket, LANGARI, Abdolreza, ZHANG, Lisha, WE, Hong Bok
Year of Publication 02.02.2023

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SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES

by LI, Yuan, PATIL, Aniket, LANGARI, Abdolreza, ZHANG, Lisha, WE, Hong Bok
Year of Publication 02.02.2023

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Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction

by Li, Yuan, Ganguly, Shrestha, Huang, Ching-Liou, Wang, Hui, Langari, Abdolreza, Cheung, Terence
Year of Publication 06.09.2022

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DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIRECTION AND SECOND SOLDER INTERCONNECTS ALIGNED IN A SECOND DIRECTION

by LI, Yuan, LANGARI, Abdolreza, GANGULY, Shrestha, HUANG, Ching-Liou, WANG, Hui, CHEUNG, Terence
Year of Publication 10.11.2021

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DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIRECTION AND SECOND SOLDER INTERCONNECTS ALIGNED IN A SECOND DIRECTION

by LI, Yuan, LANGARI, Abdolreza, GANGULY, Shrestha, HUANG, Ching-Liou, WANG, Hui, CHEUNG, Terence
Year of Publication 04.03.2021

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Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction

by Li, Yuan, Ganguly, Shrestha, Huang, Ching-Liou, Wang, Hui, Langari, Abdolreza, Cheung, Terence
Year of Publication 09.02.2021

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DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIRECTION AND SECOND SOLDER INTERCONNECTS ALIGNED IN A SECOND DIRECTION

by LI, Yuan, LANGARI, Abdolreza, GANGULY, Shrestha, HUANG, Ching-Liou, WANG, Hui, CHEUNG, Terence
Year of Publication 09.07.2020

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DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIRECTION AND SECOND SOLDER INTERCONNECTS ALIGNED IN A SECOND DIRECTION

by LI, Yuan, LANGARI, Abdolreza, GANGULY, Shrestha, HUANG, Ching-Liou, WANG, Hui, CHEUNG, Terence
Year of Publication 02.07.2020

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METHOD AND STRUCTURE FOR TEMPERATURE STABILIZATION IN SEMICONDUCTOR DEVICES

by HASHEMI, SEYED, H, CHUNGPAIBONNPATANA, SURASIT, LANGARI, ABDOLREZA
Year of Publication 30.07.2014

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KÜHLSYSTEM FÜR IMPULS-LEISTUNGSELEKTRONIK

by HASHEMI, SEYED, LANGARI, ABDOLREZA
Year of Publication 15.11.2008

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Sense lines for high-speed application packages

by PATIL, ANIKET, WE, HONG BOK, LI, YUAN, ZHANG, LI-SHA, LANGARI, ABDOLREZA
Year of Publication 01.04.2023

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Cooling system for power amplifier and communication system employing the same

by LANGARI; ABDOLREZA
Year of Publication 17.10.2000

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COOLING SYSTEM FOR POWER AMPLIFIER AND COMMUNICATION SYSTEM EMPLOYING THE SAME

by LANGARI, ABDOLREZA
Year of Publication 20.04.2000

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DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIRECTION AND SECOND SOLDER INTERCONNECTS ALIGNED IN A SECOND DIRECTION

by WANG HOWARD, LANGARI ABDOLREZA, HUANG CHING-LIOU, GANGULY SUJOY, JANG TAEHEE, LI YUFU
Year of Publication 20.08.2021

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