by Fengqun Lang, Yamaguchi, Hiroshi, Nakagawa, Hiroshi, Sato, Hiroshi
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2015)

by Lang, Fengqun, Yamaguchi, Hiroshi, Ohashi, Hiromichi, Sato, Hiroshi
Published in Journal of electronic materials (01.07.2011)

by Lang, Fengqun, Nakagawa, Hiroshi, Yamaguchi, Hiroshi
Published in Gold Bulletin (01.05.2014)

by Lang, Fengqun, Tanaka, Hiroyuki, Munegata, Osamu, Taguchi, Toshihiko, Narita, Toshio
Published in Materials characterization (01.03.2005)

by Lang, Fengqun, Yu, Zhiming
Published in Surface & coatings technology (01.08.2001)

by Lang, Fengqun, Nakagawa, Hiroshi, Aoyagi, Masahiro, Ohashi, Hiromichi, Yamaguchi, Hiroshi
Published in Journal of materials science. Materials in electronics (01.09.2010)

by Lang, Fengqun, Narita, Toshio
Published in Intermetallics (01.04.2007)

by Lang, Fengqun, Yamaguchi, Hiroshi, Nakagawa, Hiroshi, Sato, Hiroshi
Published in Journal of the Electrochemical Society (01.01.2013)

by Lang, Fengqun, Yamaguchi, Hiroshi, Nakagawa, Hiroshi, Sato, Hiroshi
Published in Journal of electronic materials (2015)

by NARITA, Toshio, FENGQUN LANG, KEMAS ZAINI THOSIN, YOSHIOKA, Takayuki, IZUMI, Takeshi, YAKUWA, Hiroshi, HAYASHI, Shigenari
Published in Oxidation of metals (01.12.2007)

by Kato, Fumiki, Lang, Fengqun, Nakagawa, Hiroshi, Yamaguchi, Hiroshi, Kimura, Ryuuji, Okada, Keiji, Shindo, Hiroaki, Ooi, Tatsuya, Tamaki, Rei, Sekine, Shigenobu, Sato, Hiroshi
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)

by Fengqun Lang, Hayashi, Y., Nakagawa, H., Aoyagi, M., Ohashi, H.
Published in IEEE transactions on advanced packaging (01.11.2009)

by Lang, Fengqun, Yamaguchi, Hiroshi, Nakagawa, Hiroshi, Sato, Hiroshi
Published in Journal of electronic materials (01.01.2015)

by Fengqun Lang, Yamaguchi, H., Nakagawa, H., Sato, H.
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)

by Kato, Fumiki, Simanjorang, Rejeki, Lang, Fengqun, Nakagawa, Hiroshi, Yamaguchi, Hiroshi, Sato, Hiroshi
Published in Japanese Journal of Applied Physics (01.04.2015)

by Sato, Hiroshi, Kato, Fumiki, Nakagawa, Hiroshi, Yamaguchi, Hiroshi, Rejeki, Simanjorang, Lang, Fengqun
Published in 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) (01.12.2013)

by Fengqun Lang, Oohashi, H, Yamaguchi, H
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)

by Lang, Fengqun, Narita, Toshio
Published in Intermetallics (2007)

by Fengqun Lang, Hayashi, Y., Nakagawa, H., Aoyagi, M., Ohashi, H.
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)

by Fengqun Lang, Hayashi, Y., Nakagawa, H., Aoyagi, M., Ohashi, H.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)