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Year of Publication 08.06.2023
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Flauta, Randolph Estal, Zhou, Zhou, Kan, Wae Lam, Hor, Wai Hung William
Year of Publication 07.06.2023
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Year of Publication 07.06.2023
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Through hole side wettable flank
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Year of Publication 18.01.2022
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Year of Publication 18.01.2022
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Walczyk, Sven, Funke, Hans-Juergen, Lam, Kan Wae, Hor, Wai Hung William
Year of Publication 12.11.2020
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Year of Publication 12.11.2020
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Electronic device and method of making same
Shum, Chi Ling, Yeung, Shun Tik, Umali, Pompeo V, Leung, Chi Ho, Lam, Kan Wae
Year of Publication 28.05.2019
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Year of Publication 28.05.2019
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Packaged semiconductor device with interior polygonal pads
Lloyd, Clifford John, Wong, Fei-ying, Wan, Chi Hoo, Groenhuis, Roelf Anco Jacob, Lam, Kan Wae
Year of Publication 13.03.2019
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Year of Publication 13.03.2019
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Packaged semiconductor device with interior polygonal pads
Groenhuis, Roelf A. J, Lloyd, Clifford J, Wan, Chi Hoo, Lam, Kan Wae, Wong, Fei Ying
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Year of Publication 21.08.2018
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Reversible semiconductor die
Jans, Thierry, Walczyk, Sven, Yeung, Shun Tik, Horstink, Harrie Martinus Maria, Umali, Pompeo V, Leung, Chi Ho, Lam, Kan Wae
Year of Publication 16.04.2019
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Year of Publication 16.04.2019
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Semiconductor device and lead frame therefor
Yeung, Shun Tik, Funke, Hans-Juergen, Yip, Shu-Ming, Umali, Pompeo V, Leung, Chi Ho, Lam, Kan Wae
Year of Publication 09.04.2019
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Year of Publication 09.04.2019
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ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
UMALI Pompeo V, YEUNG SHUN TIK, LAM Kan Wae, LEUNG Chi Ho, CHAU On Lok
Year of Publication 15.06.2017
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Year of Publication 15.06.2017
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Built-up lead frame package and method of making thereof
Shum Chi Ling, Lam Kan Wae, Umali Pompeo V, Yeung Shun Tik, Leung Chi Ho
Year of Publication 02.05.2017
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Year of Publication 02.05.2017
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SEMICONDUCTOR DIE FOR USE IN DIFFERENT PACKAGE TYPES
Jans, Thierry, Yeung, Shun Tik, Walcyzk, Sven, Horstink, Harrie Martinus Maria, Umali, Pompeo V, Leung, Chi Ho, Lam, Kan Wae
Year of Publication 11.04.2018
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Year of Publication 11.04.2018
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