A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers
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Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
Nair Gourikutty, Sajay Bhuvanendran, Long, Lau Boon, Wei, Seit Wen, Jong, Ming Chinq, Wee Ho, David Soon, Wu, Jiaqi, Lim, Teck Guan, Mandal, Rathin, Choong, Chong Ser, Yee, Chia Lai, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Integration of fine-pitched Through-Silicon Vias and Integrated Passive Devices
Shariff, D., Marimuthu, P. C., Hsiao, K., Asoy, L., Chia Lai Yee, Aung Kyaw Oo, Buchanan, K., Crook, K., Wilby, T., Burgess, S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding