The performance and fracture mechanism of solder joints under mechanical reliability test
Jang, Wei-Luen, Wang, Tai-Siang, Lai, Yen-Fen, Lin, Kwang-Lung, Lai, Yi-Shao
Published in Microelectronics and reliability (01.07.2012)
Published in Microelectronics and reliability (01.07.2012)
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