Recent developments in stainless steels
Lo, K.H., Shek, C.H., Lai, J.K.L.
Published in Materials science & engineering. R, Reports : a review journal (29.05.2009)
Published in Materials science & engineering. R, Reports : a review journal (29.05.2009)
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Journal Article
Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys
Law, C M T, Wu, C M L, Yu, D Q, Wang, L, Lai, J K L
Published in Journal of electronic materials (01.01.2006)
Published in Journal of electronic materials (01.01.2006)
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Journal Article
Synthesis and structural characterization of rutile SnO2 nanocrystals
Chen, Zhiwen, Lai, J. K. L., Shek, C. H., Chen, Haydn
Published in Journal of materials research (01.06.2003)
Published in Journal of materials research (01.06.2003)
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Journal Article
Effects of pre-treatment on the ac magnetic susceptibility and ageing behaviour of duplex stainless steels
Lo, K.H., Lai, J.K.L., Shek, C.H., Li, D.J.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.04.2007)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.04.2007)
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Journal Article
Magnetic and transformation behaviour of duplex stainless steels under non-isothermal conditions and temperature-fluctuation monitoring
Lo, K.H., Lai, J.K.L., Shek, C.H., Li, D.J.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.04.2007)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.04.2007)
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Journal Article
Failure of Centrifugal Chillers: Coating and Anode Location Problems
LAI, J. K. L, LO, K. H, WONG, K. W
Published in Journal of failure analysis and prevention (01.06.2012)
Published in Journal of failure analysis and prevention (01.06.2012)
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Journal Article
Pulsed Laser Ablation for Tin Dioxide: Nucleation, Growth, and Microstructures
Chen, Z. W., Wu, C. M. L., Shek, C. H., Lai, J. K. L., Jiao, Z., Wu, M. H.
Published in Critical reviews in solid state and materials sciences (01.07.2008)
Published in Critical reviews in solid state and materials sciences (01.07.2008)
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Journal Article
Failure of a Sliding Metal Gate Due to Single-Impact Bending Fracture and Poor Installation Practice
LAI, J. K. L, LO, K. H, WONG, K. W
Published in Journal of failure analysis and prevention (01.02.2011)
Published in Journal of failure analysis and prevention (01.02.2011)
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Journal Article
Microstructural evolution of oxides and semiconductor thin films
CHEN, Z. W, JIAO, Z, WU, M. H, SHEK, C. H, WU, C. M. L, LAI, J. K. L
Published in Progress in materials science (01.09.2011)
Published in Progress in materials science (01.09.2011)
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Journal Article
Direct robust bonding between Sn-based solder and Si substrate
YU, D. Q, WU, C. M. L, WONG, Y. W, LAI, J. K. L
Published in Journal of materials science. Materials in electronics (01.10.2007)
Published in Journal of materials science. Materials in electronics (01.10.2007)
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Journal Article
Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying
WU, C. M. L, HUANG, M. L, LAI, J. K. L, CHAN, Y. C
Published in Journal of electronic materials (01.08.2000)
Published in Journal of electronic materials (01.08.2000)
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Journal Article
Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method
Yu, D.Q., Wu, C.M.L., Law, C.M.T., Wang, L., Lai, J.K.L.
Published in Journal of alloys and compounds (19.04.2005)
Published in Journal of alloys and compounds (19.04.2005)
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