Extracting Radio Frequency Properties of a Typical Through-Silicon Via Structure With a Self-Developed Deembedding Technique
Tseng, Kun-Fu, Huang, Tzu-Yen, Lwo, Ben-Je, Ni, Tom
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2019)
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Journal Article
Environmental Factors Affecting TSV Reliability
Lwo, Ben-Je, Lin, Frank M.-S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
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Journal Article
A Study on Electrical Reliability Criterion on Through Silicon Via Packaging
Lwo, Ben-Je, Tseng, Kuo-Hao, Tseng, Kun-Fu
Published in Journal of electronic packaging (01.06.2016)
Published in Journal of electronic packaging (01.06.2016)
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Journal Article
A complete resistance extraction methodology and circuit models for typical TSV structures
Chung, Hsien, Tu, Che-Min, Lwo, Ben-Je, Lee, Chih-Yuan
Published in International journal of electronics (01.09.2013)
Published in International journal of electronics (01.09.2013)
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Journal Article
Contact resistance of the micro bumps in a typical TSV structure
Ben-Je Lwo, Chia-Liang Teng, Ni, Tom, Lu, Shirley
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
Measuring Seebeck coefficient on thin film thermoelectric materials without metallization treatment
Yao-Shing Chen, Shih-Jue Lin, Ben-Je Lwo
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
Performance analyses on an advanced high-power diode packaging structures
Yong-Cheng Lu, Kuo-Hsin Huang, Ben-Je Lwo, Jeff Kao, Lee, Robert, Chung, Harrison, Tzu-Yen Huang
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
TSV reliability model under various stress tests
Ben-Je Lwo, Frank, Lin, M-S, Kuo-Hsin Huang
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Thermal humidity reliability criterions for a typical TSV device
Ben-Je Lwo, Chia-Liang Teng, Zi-Yan Huang, Kuo-Hao Tseng, Kun-Fu Tseng
Published in 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.05.2016)
Published in 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.05.2016)
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Conference Proceeding
Reliability analyses on a TSV structure for CMOS image sensor
Ben-Je Lwo, Chung-Yen Ni
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Warpage Reduction on a Typical Fan-out Wafer Level Process by an Encircling Silicon Ring
Chung, Hsien, Li, Yu-Jyun, Lwo, Ben-Je, Ni, Tom
Published in 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.12.2021)
Published in 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.12.2021)
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Conference Proceeding
Reliability of a typical TSV structure with thermal bias
Ben-Je Lwo, Kuo-Hao Tseng, Kun-Fu Tseng
Published in 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2013)
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Published in 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2013)
Conference Proceeding
Flexible Thermoelectric Films by Electrospinning
Chen, Yao-Shing, Lwo, Ben-Je
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.10.2020)
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.10.2020)
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Conference Proceeding