Diverse clinical manifestations of acquired vulvar lymphangioma: a report of five cases in Vietnamese women
Nguyen, Tho Thi Thanh, Hoang, Anh Nguyen Ngoc, Luu, Thu Nguyen Anh, Nguyen, Thuy Thi Phan, Doan, Em Van Loi, Chan, Tu Nguyen Anh, Nguyen, Hao Trong
Published in Dermatology reports (29.01.2024)
Published in Dermatology reports (29.01.2024)
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Journal Article
Study of electromigration in Cu and Ag wirebonds operating at high current in extreme environments
Lall, Pradeep, Deshpande, Shantanu, Luu Nguyen
Published in 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2017)
Published in 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2017)
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Conference Proceeding
COPD EXACERBATION READMISSION QUALITY IMPROVEMENT: COMMUNITY EXPERIENCE FROM GEISINGER WYOMING VALLEY MEDICAL CENTER
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Published in Chest (01.10.2024)
Published in Chest (01.10.2024)
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SEPSIS ALERTS: A GUIDE OR SIREN?
NGUYEN-LUU, TRISTAN, SIMONETTI, GREG, GANDHI, ZAINAB J, ABOU ISSA, ABDELFATAH, HUMAYUN, SARA, GEORGIEVSKIY, IGOR, DJEKIDEL, KARIM, NAIK, SREELATHA
Published in Chest (01.10.2024)
Published in Chest (01.10.2024)
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VITAMIN B12 AND SEPTIC SHOCK MORTALITY: A SYSTEMATIC REVIEW AND META-ANALYSIS
SIMONETTI, GREG, DESAI, KARNA, ROBINSON, RICHARD J, NGUYEN-LUU, TRISTAN, SHARMA, NISHITA, F NAIDOO, SHIVA, SHARIFF, RAYHAN, SHARMA, ROHIT
Published in Chest (01.10.2024)
Published in Chest (01.10.2024)
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Journal Article
Principal Components Regression Model for Prediction of Acceleration Factors for Copper-Aluminum Wirebonds Subjected to Harsh Environments
Lall, Pradeep, Deshpande, Shantanu, Nguyen, Luu
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
The anomalous microstructural, tensile, and aging response of thin-cast Sn3.9Ag0.6Cu lead-free solder
QIANG XIAO, LUU NGUYEN, ARMSTRONG, William D
Published in Journal of electronic materials (01.05.2005)
Published in Journal of electronic materials (01.05.2005)
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Journal Article
Multiphysics-modeling of corrosion in copper-aluminum interconnects in high humidity environments
Lall, Pradeep, Yihua Luo, Luu Nguyen
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Anomalously high tensile creep rates from thin cast Sn3.9Ag0.6Cu lead-free solder
QIANG XIAO, LUU NGUYEN, ARMSTRONG, William D
Published in Journal of electronic materials (01.07.2005)
Published in Journal of electronic materials (01.07.2005)
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Journal Article