Nanoporous Silica as an Ultralow-k Dielectric
Jin, Changming, Luttmer, J.D., Smith, Douglas M., Ramos, Teresa A.
Published in MRS bulletin (01.10.1997)
Published in MRS bulletin (01.10.1997)
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Journal Article
Analysis of copper grains in damascene trenches after rapid thermal processing or furnace anneals
JIANG, Qing-Tang, NOWELL, Matt, FORAN, Brendan, FRANK, Aaron, HAVEMANN, R. H, PARIHAR, Vijay, AUGUR, R. A, LUTTMER, J. D
Published in Journal of electronic materials (2002)
Published in Journal of electronic materials (2002)
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Conference Proceeding
Journal Article
Integrated CVD–PVD Al plug processing for sub-half micron features
Konecni, A, Dixit, G, Russell, N.M, Luttmer, J.D, Havemann, R.H
Published in Thin solid films (04.05.1998)
Published in Thin solid films (04.05.1998)
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Journal Article
Conference Proceeding
Integrated barrier/plug fill schemes for high aspect ratio Gb DRAM contact metallization
Chen, Yu-Pei, Dixit, Girish A, Lu, Jiong-Ping, Hsu, Wei-Yung, Konecni, Anthony J, Luttmer, J.D, Havemann, Robert H
Published in Thin solid films (04.05.1998)
Published in Thin solid films (04.05.1998)
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Journal Article
Conference Proceeding
A new process for depositing tungsten nitride thin films
LU, J. P, HSU, W. Y, LUTTMER, J. D, MAGEL, L. K, TSAI, H. L
Published in Journal of the Electrochemical Society (01.02.1998)
Published in Journal of the Electrochemical Society (01.02.1998)
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Journal Article
Characterization and aluminum metallization of a parylene AF-4 surface
Sutcliffe, R, Lee, W.W, Gaynor, J.F, Luttmer, J.D, Martini, D, Kelber, J, Plano, M.A
Published in Applied surface science (01.04.1998)
Published in Applied surface science (01.04.1998)
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Journal Article
A novel process for fabricating conformal and stable TiN-based barrier films
LU, J. P, HSU, W. Y, HONG, Q. Z, DIXIT, G. A, LUTTMER, J. D, HAVEMANN, R. H, MAGEL, L. K
Published in Journal of the Electrochemical Society (01.12.1996)
Published in Journal of the Electrochemical Society (01.12.1996)
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Journal Article
Effect of Ar sputter etch on the texture of Ti and Al/TiN/Ti metal stack
HSU, W.-Y, HONG, Q.-Z, LIU, H.-Y, DOUGLAS, M, TAYLOR, K, MAGEL, L. K, LUTTMER, J. D, HAVEMANN, R. H
Published in Journal of the Electrochemical Society (01.09.1997)
Published in Journal of the Electrochemical Society (01.09.1997)
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Journal Article
Thermal stability of Al/barrier/TiSix multilayer structures
LU, J. P, HSU, W. Y, HONG, Q. Z, DIXIT, G. A, LUTTMER, J. D, HAVEMANN, R. H, CHEN, P. J, TSAI, H. L, MAGEL, L. K
Published in Thin solid films (04.05.1998)
Published in Thin solid films (04.05.1998)
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Conference Proceeding
Journal Article
Electrode materials for hydrobromic acid electrolysis in Texas Instruments' solar chemical converter
LUTTMER, J. D, KONRAD, D, TRACHTENBERG, I
Published in Journal of the Electrochemical Society (01.05.1985)
Published in Journal of the Electrochemical Society (01.05.1985)
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Journal Article
Performance Predictions for Solar‐Chemical Converters Based on Photoelectrochemical I‐V Curves
Luttmer, J. D., Trachtenberg, Isaac
Published in Journal of the Electrochemical Society (01.06.1985)
Published in Journal of the Electrochemical Society (01.06.1985)
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Journal Article
Annealing impact on damascene Cu resistivity and microstructures
Qing-Tang Jiang, Ming-Hsing Tsai, Frank, A., Parihar, V., Nowell, M., Augur, R.A., Havemann, R.H., Luttmer, J.D.
Published in 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) (2001)
Published in 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) (2001)
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Conference Proceeding
Thermal stability of Al/barrier/TiSi sub(x) multilayer structures
Lu, J P, Hsu, W Y, Hong, Q Z, Dixit, G A, Luttmer, J D, Havemann, R H, Chen, P J, Tsai, H L, Magel, L K
Published in Thin solid films (04.05.1998)
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Published in Thin solid films (04.05.1998)
Journal Article