Transmission of 96 × 100-Gb/s Bandwidth-Constrained PDM-RZ-QPSK Channels With 300% Spectral Efficiency Over 10610 km and 400% Spectral Efficiency Over 4370 km
CAI, Jin-Xing, YI CAI, DAVIDSON, Carl R, FOURSA, Dmitri G, LUCERO, Alan J, SINKIN, Oleg V, PATTERSON, William W, PILIPETSKII, Alexei N, MOHS, Georg, BERGANO, Neal S
Published in Journal of lightwave technology (15.02.2011)
Published in Journal of lightwave technology (15.02.2011)
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Conference Proceeding
Journal Article
Long-haul 40 Gb/s DWDM transmission with aggregate capacities exceeding 1 Tb/s
Jin-Xing Cai, Nissov, M., Davidson, C.R., Pilipetskii, A.N., Mohs, G., Haifeng Li, Yi Cai, Golovchenko, E.A., Lucero, A.J., Foursa, D.G., Bergano, N.S.
Published in Journal of lightwave technology (01.12.2002)
Published in Journal of lightwave technology (01.12.2002)
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Journal Article
Transmission of 40-Gb/s WDM signals over transoceanic distance using conventional NZ-DSF with receiver dispersion slope compensation
Jin-Xing Cai, Davidson, C.R., Nissov, M., Haifeng Li, Anderson, W.T., Yi Cai, Li Liu, Pilipetskii, A.N., Foursa, D.G., Patterson, W.W., Corbett, P.C., Lucero, A.J., Bergano, N.S.
Published in Journal of lightwave technology (01.01.2006)
Published in Journal of lightwave technology (01.01.2006)
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Conference Proceeding
Semi-empirical stress/energy-based acceleration of temperature cycling failure
Huitink, David, Lucero, Alan
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
20 Tbit/s Transmission Over 6860 km With Sub-Nyquist Channel Spacing
Jin-Xing Cai, Davidson, C. R., Lucero, A., Hongbin Zhang, Foursa, D. G., Sinkin, O. V., Patterson, W. W., Pilipetskii, A. N., Mohs, G., Bergano, N. S.
Published in Journal of lightwave technology (15.02.2012)
Published in Journal of lightwave technology (15.02.2012)
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Journal Article
Setting use conditions for reliability modeling
Kwasnick, Robert, Polasam, Praveen, Lucero, Alan
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
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Conference Proceeding
Acceleration of chip - Package failures in temperature cycling
Huitink, David, Enamul, Kabir, Rangaraj, Sudarshan, Lucero, Alan
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
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Conference Proceeding
Accelerated stress testing methodology to risk assess silicon-package thermomechanical failure modes resulting from moisture exposure under use condition
Rangaraj, S., Daeil Kwon, Min Pei, Hicks, J., Leatherman, G., Lucero, A., Wilson, T., Streit, S., Jun He
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Conference Proceeding
First dispersion-flattened transpacific undersea system: from design to terabit/s field trial
Bakhshi, B., Manna, M., Mohs, G., Kovsh, D.I., Lynch, R.L., Vaa, M., Golovchenko, E.A., Patterson, W.W., Anderson, W.T., Corbett, P., Shijun Jiang, Sanders, M.M., Haifeng Li, Harvey, G.T., Lucero, A., Abbott, S.M.
Published in Journal of lightwave technology (01.01.2004)
Published in Journal of lightwave technology (01.01.2004)
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Conference Proceeding
Optimized reliability test design to reduce uncertainties in reliability assessment
Daeil Kwon, Lucero, A. E.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Define electrical packing temperature cycling requirement with field measured user behavior data
Min Pei, Ru Han, Daeil Kwon, Lucero, Alan, Vasudevan, Vasu, Kwasnick, Robert, Polasam, Praveen S.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
A preliminary solder joint life prediction model by experiment and simulation for translation of use condition to temperature cycling test condition
Ru Han, Min Pei, Lucero, Alan, Daeil Kwon, Yun Ge, Harries, Richard, Bhatti, Pardeep, Tieyu Zheng
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding