Vertically Aligned In-Plane-Switching LCD Mode With Novel Pixel Circuits
Tien-Lun Ting, Cho-Yan Chen, Sau-Wen Tsao, Mei-Ju Lu, Yen-Ying Kung, Wen-Hao Hsu, Jenn-Jia Su
Published in Journal of display technology (01.10.2013)
Published in Journal of display technology (01.10.2013)
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Journal Article
Chemical reactions of atomic lithium and molecular calcium monohydride at 1 K
Singh, Vijay, Hardman, Kyle S, Tariq, Naima, Lu, Mei-Ju, Ellis, Aja, Morrison, Muir J, Weinstein, Jonathan D
Published in Physical review letters (18.05.2012)
Published in Physical review letters (18.05.2012)
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Journal Article
Robust Edge Coupling Probe Applied in Wafer-Level Optical Testing
Huang, Sheng-Ho, Lin, Chen-Yu, Fu, Yi-Keng, Mu, Sin-Yuan, Lu, Mei-Ju, Cheng, Chia-Sheng, Chen, Jihan
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Butt-Coupling Optical Probe Card for Wafer-Scale Photonic-Integrated-Circuits Test with Polarization Control
Wu, Cheng-Yu, Lee, Ming-Chang M., Lu, Mei-Ju, Mu, Sin-Yuan, Chen, Jihan, Cheng, Chia-Sheng
Published in 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC) (26.06.2023)
Published in 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC) (26.06.2023)
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Conference Proceeding
Inelastic collisions of CaH with He at cryogenic temperatures
Singh, Vijay, Hardman, Kyle S., Lu, Mei-Ju, Ellis, Aja, Morrison, Muir J., Weinstein, Jonathan D.
Published in Molecular physics (01.07.2013)
Published in Molecular physics (01.07.2013)
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Journal Article
Contaminant failure analysis: A particle library and its search engine
Mei-Ju Lu, Ying-Ta Chiu, Ping-Feng Yang
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
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Conference Proceeding
MEMS heterogeneous packaged broadband electromagnetic induction vibration sensor and remote temperature sensor for industrial intelligent manufacturing
Yu-Sheng Lai, Shao-Hui Hsu, Chun-Chi Chen, Meiyi Li, Ju-Mei Lu, Hsu-Chun Cheng, Jui-Min Liu, Yen-Chang Chen, Yu-Tsung Tuan, Cheng-San Wu, Jia-Min Shieh, Wen-Kuan Yeh
Published in 2017 IEEE International Electron Devices Meeting (IEDM) (01.12.2017)
Published in 2017 IEEE International Electron Devices Meeting (IEDM) (01.12.2017)
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Conference Proceeding
Advanced Packaging Technologies for Copackaged Optics
Lu, Mei-Ju, Mu, Sin-Yuan, Cheng, Chia-Sheng, Chen, Jihan
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Encapsulation of film bulk acoustic resonator filters using a wafer-level microcap array
Lin, Chung-Hsien, Lu, Ju-Mei, Fang, Weileun
Published in Journal of micromechanics and microengineering (01.08.2005)
Published in Journal of micromechanics and microengineering (01.08.2005)
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Journal Article
Temperature coefficient of resistance related to amorphous silicon/metal contact design of microbolometers
Su, Jyun-Hao, Yeh, Wen-Kuan, Chang, Wen-Teng, Wu, Ban-Li, Lu, Ju-Mei, Wang, Jin-Hung, Fang, Yean-Kuen, Chen, Po-Ying
Published in 2016 3rd International Conference on Devices, Circuits and Systems (ICDCS) (01.03.2016)
Published in 2016 3rd International Conference on Devices, Circuits and Systems (ICDCS) (01.03.2016)
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Conference Proceeding