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"LU DAOQIANG"
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"LU DAOQIANG"
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Overview of recent advances on isotropic conductive adhesives
by
Lu, D.D.
,
Wong, C.P.
Published in
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06
(2006)
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122
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Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same
by
Lu
,
Daoqiang
,
Hu, Chuan
,
He, Dongming
Year of Publication
01.12.2009
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123
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Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles
by
Lu
,
Daoqiang
,
Chen, Tian-An
Year of Publication
26.12.2006
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124
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Forming compliant contact pads for semiconductor packages
by
Zhou, Qing
,
Shi, Wei
,
Lu
,
Daoqiang
,
He, Jiangqi
Year of Publication
03.04.2012
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125
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Optoelectronic connectors
by
DAOQIANG LU
,
EDRIS MOHAMMED
Year of Publication
20.05.2009
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126
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Methods including fluxless chip attach processes
by
Jadhav, Susheel
,
Lu
,
Daoqiang
,
Deshpande, Nitin
Year of Publication
19.05.2009
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127
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Method for handling integrated circuit die
by
Lu
,
Daoqiang
,
Rumer, Christopher L
Year of Publication
13.06.2006
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128
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Fluxing agent for underfill materials
by
Chen, Tian-An
,
Lu
,
Daoqiang
Year of Publication
11.04.2006
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129
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Wafer-level assembly of heat spreaders for dual IHS packages
by
Lu
,
Daoqiang
,
Baskaran, Rajashree
,
Hu, Chuan
Year of Publication
13.01.2009
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Substrate with raised edge pads
by
Shi, Wei
,
Lu
,
Daoqiang
,
Zhou, Qing
,
He, Jiangqi
Year of Publication
19.07.2011
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Forming compliant contact pads for semiconductor packages
by
Zhou, Qing
,
Shi, Wei
,
Lu
,
Daoqiang
,
He, Jiangqi
Year of Publication
10.05.2011
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132
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Methods and apparatus to optically couple an optoelectronic chip to a waveguide
by
Lu
,
Daoqiang
,
Braunisch, Henning
,
Vandentop, Gilroy
Year of Publication
13.05.2008
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Split socket optical interconnect
by
Lu
,
Daoqiang
,
Alduino, Andrew C
,
Braunisch, Henning
Year of Publication
18.03.2008
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Fluxing agent for underfill materials
by
Chen, Tian-An
,
Lu
,
Daoqiang
Year of Publication
30.12.2004
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Optical package
by
Lu
,
Daoqiang
,
Braunisch, Henning
,
Vandentop, Gilroy
Year of Publication
16.10.2007
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Large bumps for optical flip chips
by
Fang, Ming
,
Dubin, Valery
,
Lu
,
Daoqiang
Year of Publication
09.10.2007
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137
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Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane
by
Lu
,
Daoqiang
,
Wong, Ching-Ping
Year of Publication
25.05.2004
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138
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Embedded on-die laser source and optical interconnect
by
Lu
,
Daoqiang
,
Block, Bruce A
,
He, Dongming
Year of Publication
31.07.2007
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Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same
by
Lu
,
Daoqiang
,
He, Jiangqi
,
Zeng, Xiang Yin
,
Tang, Jiamiao
Year of Publication
25.05.2010
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On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
by
Braunisch, Henning
,
Lu
,
Daoqiang
,
Vandentop, Gilroy J
Year of Publication
26.06.2007
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