Selected papers from HDP07
Liu, Johan, Lu, Daoqiang, Andersson, Cristina
Published in Soldering & surface mount technology (10.04.2009)
Published in Soldering & surface mount technology (10.04.2009)
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Journal Article
Flex-circuit chip-to-chip interconnects
Braunisch, H., Jaussi, J.E., Mix, J.A., Trobough, M.B., Horine, B.D., Prokofiev, V., Daoqiang Lu, Baskaran, R., Meier, P.C.H., Dong-Ho Han, Mallory, K.E., Leddige, M.W.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Recent advances in electrically conductive adhesives for electronics applications
Wong, C.P., Daoqiang Lu
Published in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) (2000)
Published in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) (2000)
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Conference Proceeding
Development of solder replacement conductive adhesives with stable resistance and superior impact performance
Daoqiang Lu, Wong, C.P.
Published in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) (2000)
Published in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) (2000)
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Conference Proceeding
Light curable composition
Zhang, Heqiang, Song, Chongjian, Lu, Benchi, Lu, Daoqiang, Wang, Zuohe
Year of Publication 07.03.2023
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Year of Publication 07.03.2023
Patent