MICRO-HINGE FOR AN ELECTRONIC DEVICE
CHEAH BOK ENG, LOO HOWE YIN, LIM MIN SUET, OH POH TAT, KONG JACKSON CHUNG PENG
Year of Publication 03.09.2019
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Year of Publication 03.09.2019
Patent
MICRO-HINGE FOR ELECTRONIC DEVICE
CHEAH BOK ENG, LOO HOWE YIN, LIM MIN SUET, OH POH TAT, JACKSON CHUNG PENG KONG
Year of Publication 25.04.2019
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Year of Publication 25.04.2019
Patent
WEARABLE ELECTRONIC DEVICES AND COMPONENTS THEREOF
MEYER THORSTEN, WAIDHAS BERND, LOO HOWE YIN, BARTH HANS JOACHIM, PLENKERS DIRK, CHEW YEN HSIANG, OOI KOOI CHI
Year of Publication 29.03.2017
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Year of Publication 29.03.2017
Patent
MICRO-HINGE FOR AN ELECTRONIC DEVICE
CHEAH BOK ENG, LOO HOWE YIN, LIM MIN SUET, OH POH TAT, KONG JACKSON CHUNG PENG
Year of Publication 05.10.2016
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Year of Publication 05.10.2016
Patent
WEARABLE ELECTRONIC DEVICES AND COMPONENTS THEREOF
MEYER THORSTEN, WAIDHAS BERND, LOO HOWE YIN, BARTH HANS JOACHIM, PLENKERS DIRK, CHEW YEN HSIANG, OOI KOOI CHI
Year of Publication 16.06.2016
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Year of Publication 16.06.2016
Patent
CPU Package Design Optimization for Performance Improvement and Package Cost reduction
Howe Yin Loo, Boon Howe Oh, Poh Tat Oh, Eng Kwong Lee
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
Package Routing and Thermal Analysis on a Multi-Chip Package (MCP)
Boon Howe Oh, Eng Kwong Lee, Howe Yin Loo, Poh Tat Oh
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
Challenges in Stacked CSP Packaging Technology
Boon Howe Oh, Howe Yin Loo, Poh Tat Oh, Eng Kwong Lee
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
The Evolution of CPU Packaging Technology and Future Challenges
Boon Howe Oh, Eng Kwong Lee, Howe Yin Loo, Poh Tat Oh
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
LAPTOP ARRANGEMENT FOR HEAT CONTROL
GOH, Chin Kung, CHEE, Jiunn Shyong, CHUAH, Tin Poay, LIM, Yew San, LOO, Howe Yin
Year of Publication 02.05.2024
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Year of Publication 02.05.2024
Patent
Expandable thermal solution for laptops
Ku, Jeff, Chuah, Tin Poay, Loo, Howe Yin, Nien, Cora Shih Wei, Goh, Chin Kung, Lim, Yew San
Year of Publication 13.08.2024
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Year of Publication 13.08.2024
Patent
Micro-hinge for an electronic device
Loo, Howe Yin, Cheah, Bok Eng, Kong, Jackson Chung Peng, Oh, Poh Tat, Lim, Min Suet
Year of Publication 02.05.2023
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Year of Publication 02.05.2023
Patent
EXTENDED STIFFENER FOR PLATFORM MINIATURIZATION
YONG, Khang Choong, CHEAH, Bok Eng, LIM, Min Suet, LOO, Howe Yin, KONG, Jackson Chung Peng, GOH, Eng Huat
Year of Publication 14.02.2024
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Year of Publication 14.02.2024
Patent
COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES
CHEAH, Bok Eng, ONG, Jenny Shio Yin, LOH, Chee Min, CHUAH, Tin Poay, LOO, Howe Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 04.01.2024
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Year of Publication 04.01.2024
Patent
MULTI-ORIENTATION DISPLAY DEVICE
Loo, Howe Yin, Cheah, Bok Eng, Kong, Jackson Chung Peng, Browning, David W, Oh, Poh Tat, Lim, Min Suet, Yee, Chee Chun
Year of Publication 21.12.2023
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Year of Publication 21.12.2023
Patent