Heterogeneous Integration System in Display (HiSID) for Next-Generation Terminal Device
Long, Haohui, Zhang, Li, Ma, Huicai, Li, Jianhui, Xia, Jiye, Zhang, Yunan, Chen, Jianqiu
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2022)
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Journal Article
Numerical and Experimental Analyses of Component Failure Risk in a Mobile Phone Under Drop Test
Liu, Zhen, Fang, Mingang, Shi, Lei, Chen, Zhuo, Li, Jianhui, Long, Haohui, Zhu, Wenhui
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2022)
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Journal Article
Drop failure modes of a wafer-level chip-scale packaging
Mingliang Huang, Shuang Liu, Ning Zhao, Haohui Long, Jianhui Li, Weiqiang Hong
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
크랙 검출 회로를 구비한 장치 및 검출 시스템
FANG JIANPING, LIU TAIXIANG, YE RUNQING, SI HUI, LONG HAOHUI, HONG WEIQIANG, WANG YUNFEI
Year of Publication 01.07.2019
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Year of Publication 01.07.2019
Patent
Artificial intelligence aided design for heterogeneous integration system in display
Huang, Sixin, Zhou, Ziqing, Gao, Jiaying, Long, Haohui, Li, Jianhui
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
The structural optimization of heterogeneous integration system in display based on thermal-mechanical behaviors
Huang, Sixin, Long, Haohui, Li, Jianhui, Shen, Rilin
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding