Study of the effect of reflow time and temperature on Cu–Sn intermetallic compound layer reliability
Huang, Wei, Loman, James M, Sener, Bülent
Published in Microelectronics and reliability (01.08.2002)
Published in Microelectronics and reliability (01.08.2002)
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Journal Article
Reliability block diagram simulation techniques applied to the IEEE Std. 493 standard network
Wendai Wang, Loman, J.M., Arno, R.G., Vassiliou, P., Furlong, E.R., Ogden, D.
Published in IEEE transactions on industry applications (01.05.2004)
Published in IEEE transactions on industry applications (01.05.2004)
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Journal Article
Real-time content detection in ISP transmissions
Loman, James M, Gerber, Alexandre, Spatscheck, Oliver, Todimala, Ajay
Year of Publication 29.05.2012
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Year of Publication 29.05.2012
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