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Year of Publication 18.11.2010
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Year of Publication 15.06.2017
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Year of Publication 15.06.2017
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Flip chip assembly process for ultra thin substrate and package on package assembly
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Year of Publication 19.07.2016
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Process for assembling an integrated circuit package having a substrate vent hole
VODRAHALLI NAGESH, LOKE MUN LEONG, COSTELLO MICHAEL J, RAMALINGAM SURESH, MAHAJAN RAVI V
Year of Publication 10.12.2013
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Year of Publication 10.12.2013
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FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
LIM SIH FEI, LOKE MUN LEONG, ONG KANG EU, RUDGE A. VETHANAYAGAM, MONG WENG KHOON, LIM BOK SIM, ONG TEAN WEE
Year of Publication 19.03.2015
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Year of Publication 19.03.2015
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Flip chip assembly process for ultra thin substrate and package on package assembly
LIM SIH FEI, LOKE MUN LEONG, ONG KANG EU, RUDGE A. VETHANAYAGAM, MONG WENG KHOON, LIM BOK SIM, ONE TEAN WEE
Year of Publication 30.09.2014
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Year of Publication 30.09.2014
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FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
LOKE, MUN LEONG, MONG, WENG KHOON, ONG, TEAN WEE, LIM, BOK SIM, RUDGE, A VETHANAYAGAM, ONG, KANG EU, LIM, SIH FEI
Year of Publication 30.08.2013
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Year of Publication 30.08.2013
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FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
LIM SIH FEI, LOKE MUN LEONG, ONG KANG EU, RUDGE A. VETHANAYAGAM, MONG WENG KHOON, LIM BOK SIM, ONE TEAN WEE
Year of Publication 20.12.2012
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Year of Publication 20.12.2012
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Flip chip assembly process for ultra thin substrate and package on package assembly
Mong, Weng Khoon, Rudge, A. Vethanayagam, Lim, Bok Sim, Loke, Mun Leong, Ong, Kang Eu, Lim, Sih Fei, Ong, Tean Wee
Year of Publication 04.09.2012
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Year of Publication 04.09.2012
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Flip chip assembly process for ultra thin substrate and package on package assembly
LIM SIH FEI, LOKE MUN LEONG, ONG KANG EU, RUDGE A. VETHANAYAGAM, MONG WENG KHOON, LIM BOK SIM, ONG TEAN WEE
Year of Publication 04.09.2012
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Year of Publication 04.09.2012
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FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
LOKE, MUN LEONG, MONG, WENG KHOON, ONG, TEAN WEE, LIM, BOK SIM, RUDGE, A VETHANAYAGAM, ONG, KANG EU, LIM, SIH FEI
Year of Publication 25.03.2010
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Year of Publication 25.03.2010
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FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
LOKE, MUN LEONG, MONG, WENG KHOON, ONG, TEAN WEE, LIM, BOK SIM, RUDGE, A VETHANAYAGAM, ONG, KANG EU, LIM, SIH FEI
Year of Publication 07.01.2010
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Year of Publication 07.01.2010
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FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
LIM SIH FEI, LOKE MUN LEONG, ONG KANG EU, RUDGE A. VETHANAYAGAM, MONG WENG KHOON, LIM BOK SIM, ONG TEAN WEE
Year of Publication 31.12.2009
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Year of Publication 31.12.2009
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INTEGRATED CIRCUIT PACKAGE HAVING A SUBSTRATE VENT HOLE
MAHAJAN, RAVI, V, RAMALINGAM, SURESH, VODRAHALLI, NAGESH, COSTELLO, MICHAEL, J, LOKE, MUN, LEONG
Year of Publication 15.02.2006
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Year of Publication 15.02.2006
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PACKAGE WARPAGE CONTROL
LEE LISA Y.H, ONG SOON CHUAN, LOKE MUN LEONG, HASAN ALTAF, TENG HOOI JIN, LEE MICHAEL K.L
Year of Publication 06.09.2007
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Year of Publication 06.09.2007
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Package warpage control
Lee, Michael Keat Lye, Loke, Mun Leong, Ong, Soon Chuan, Teng, Hooi Jin, Lee, Lisa Yung Hui, Hasan, Altaf
Year of Publication 24.04.2007
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Year of Publication 24.04.2007
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Package warpage control
ONG SOON CHUAN, LOKE MUN LEONG, LEE MICHAEL KEAT LYE, HASAN ALTAF, TENG HOOI JIN, LEE LISA YUNG HUI
Year of Publication 24.04.2007
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Year of Publication 24.04.2007
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