Surface characteristics and biofunctionality of a novel high-performance, hydrophilic Jeffamine-added fluoro-containing polyimide for biomedical applications
Lo, Teng-Yuan, Wang, Yen-Jen, Liu, Dean-Mo, Whang, Wha-Tzong
Published in Journal of polymer research (01.02.2015)
Published in Journal of polymer research (01.02.2015)
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Journal Article
An in situ fabrication process for highly electrical conductive polyimide/MWCNT composite films using 2,6-diaminoanthraquinone
Huang, Yi-Chia, Lin, June-Hua, Tseng, I-Hsiang, Lo, An-Ya, Lo, Teng-Yuan, Yu, Hsin-Pei, Tsai, Mei-Hui, Whang, Wha-Tzong, Hsu, Ken-Yuh
Published in Composites science and technology (18.10.2013)
Published in Composites science and technology (18.10.2013)
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Journal Article
Electrophoretic coating of amphiphilic chitosan colloids on regulating cellular behaviour
Wang, Yen-Jen, Lo, Teng-Yuan, Wu, Chieh-Hsi, Liu, Dean-Mo
Published in Journal of the Royal Society interface (06.09.2013)
Published in Journal of the Royal Society interface (06.09.2013)
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Journal Article
METHODS OF FORMING SEMICONDUCTOR PACKAGES
Kuo, Hung-Yi, Kuo, Tin-Hao, Pan, Kuo Lung, Chun, Shu-Rong, Chang, Chih-Horng, Tsai, Hao-Yi, Lo, Teng-Yuan
Year of Publication 05.09.2024
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Year of Publication 05.09.2024
Patent
Methods of forming semiconductor packages
Kuo, Hung-Yi, Kuo, Tin-Hao, Pan, Kuo Lung, Chun, Shu-Rong, Chang, Chih-Horng, Tsai, Hao-Yi, Lo, Teng-Yuan
Year of Publication 18.06.2024
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Year of Publication 18.06.2024
Patent
Semiconductor package and manufacturing method thereof
Lin, Ching-Yao, Kuo, Tin-Hao, Teng, Po-Yuan, Tsai, Hao-Yi, Wang, Chih, Lo, Teng-Yuan
Year of Publication 22.11.2022
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Year of Publication 22.11.2022
Patent
Methods of Forming Semiconductor Packages
Kuo, Hung-Yi, Kuo, Tin-Hao, Pan, Kuo Lung, Chun, Shu-Rong, Chang, Chih-Horng, Tsai, Hao-Yi, Lo, Teng-Yuan
Year of Publication 23.03.2023
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Year of Publication 23.03.2023
Patent
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Lin, Yen-Liang, Huang, Tzu-Sung, Tseng, Ming-Hung, Lin, Hsiu-Jen, Wu, Ban-Li, Tsai, Hao-Yi, Lo, Teng-Yuan
Year of Publication 02.03.2023
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Year of Publication 02.03.2023
Patent