Horizontal continuous electroless plating method and apparatus for flexible substrate capable of forming a nickel layer on a flexible substrate by electroless plating to facilitate the formation of a copper layer on the nickel layer for making a flexible copper clad laminate (FCCL)
HAMAZAWA, AKIHISA, CHEN, CHUNG-YI, FAN, SHIHNG, CHEN, WENIN, LO, CHI-HUAN
Year of Publication 16.03.2018
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Year of Publication 16.03.2018
Patent
Horizontal continuous electroplating equipment for flexible substrates
HAMAZAWA, AKIHISA, CHEN, CHUNG-YI, FAN, SHIHNG, CHEN, WENIN, LO, CHI-HUAN
Year of Publication 11.02.2017
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Year of Publication 11.02.2017
Patent