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Year of Publication 01.03.2011
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Thermal conduction by encapsulation
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Year of Publication 01.03.2011
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Year of Publication 01.03.2011
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Year of Publication 06.05.2010
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Process for improving device yield in integrated circuit fabrication
HUANG; ROBERT Y.S, HWANG; DAVID KOU-FONG, LIU; JANE QIAN, KUEHNE; STEPHEN CARL, MA; YI, LEE; JEAN LING, OH; MINSEOK
Year of Publication 07.09.1999
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Year of Publication 07.09.1999
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