Technological and Economical Analysis of Prevention Schemes for DC Bias Effects caused by UHVDC Grounding Current
Yu, Zebang, Ren, Yan, Zhao, Lei, Liu, Fangzhou
Published in 2020 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD) (16.10.2020)
Published in 2020 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD) (16.10.2020)
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