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"LIU CHING HENG"
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"LIU CHING HENG"
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CSP PROTECTED CHIP-SCALE PACKAGECSP PAD STRUCTURE
by
CHEN CHIA CHAN
,
LIU CHING HENG
,
LEE YUEH CHUAN
Year of Publication
09.01.2019
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SEMICONDUCTOR STRUCTURE WITH ISOLATION STRUCTURE
by
KUO, Chang Yu
,
LIU
,
Ching
-
Heng
,
WU, Ya-Wen
Year of Publication
21.12.2023
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PROTECTED CHIP-SCALE PACKAGE (CSP) PAD STRUCTURE
by
Lee, Yueh-Chuan
,
Chen, Chia-Chan
,
Liu
,
Ching
-
Heng
Year of Publication
05.03.2020
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Protected chip-scale package (CSP) pad structure
by
Lee, Yueh-Chuan
,
Chen, Chia-Chan
,
Liu
,
Ching
-
Heng
Year of Publication
17.12.2019
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PROTECTED CHIP-SCALE PACKAGE (CSP) PAD STRUCTURE
by
Lee, Yueh-Chuan
,
Chen, Chia-Chan
,
Liu
,
Ching
-
Heng
Year of Publication
15.08.2019
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Protected chip-scale package (CSP) pad structure
by
Lee, Yueh-Chuan
,
Chen, Chia-Chan
,
Liu
,
Ching
-
Heng
Year of Publication
30.04.2019
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PROTECTED CHIP-SCALE PACKAGE (CSP) PAD STRUCTURE
by
Lee, Yueh-Chuan
,
Chen, Chia-Chan
,
Liu
,
Ching
-
Heng
Year of Publication
03.01.2019
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Semiconductor structure with isolation structure
by
LIU
,
CHING
-
HENG
,
KUO, CHANG-YU
,
WU, YA-WEN
Year of Publication
01.01.2024
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Integrated circuit package and formation method thereof
by
LEE, YUEHUAN
,
LIU
,
CHING
-
HENG
,
CHEN, CHIAAN
Year of Publication
01.01.2020
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Integrated circuit package and formation method thereof
by
LEE, YUEHUAN
,
LIU
,
CHING
-
HENG
,
CHEN, CHIAAN
Year of Publication
01.02.2019
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Integrated circuit (IC) package and method for forming same
by
CHIAAN CHEN
,
CHING
-
HENG LIU
,
YUEHUAN LEE
Year of Publication
15.01.2019
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Geschützte Anschlussstruktur eines chipgrossen gehäusten Bauteils (Chip-Scale Package - CSP)
by
Lee, Yueh-Chuan
,
Chen, Chia-Chan
,
Liu
,
Ching
-
Heng
Year of Publication
03.01.2019
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basic electric elements
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electric solid state devices not otherwise provided for
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cladding or plating by soldering or welding
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