Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions
Suh, Daewoong, Kim, Dong W., Liu, Pilin, Kim, Hyunchul, Weninger, Jessica A., Kumar, Chetan M., Prasad, Aparna, Grimsley, Brian W., Tejada, Hazel B.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.07.2007)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.07.2007)
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Journal Article
Failure Mechanism and Kinetics Studies of Electroless Ni-P Dissolution in Pb-Free Solder Joints under Electromigration
Pilin Liu, Chavali, Chaitra, Overson, Alan, Goyal, Deepak
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Key parameters for fast Ni dissolution during electromigration of Sn0.7Cu solder joint
Pilin Liu, Overson, Alan, Goyal, Deepak
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
The Mechanism of Dense Interfacial Voids and Its Impact on Solder Joint Reliability
Pilin Liu, Lin, Cyber, Pathangey, Balu, Goyal, Deepak
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows
Li, Yan, Hatch, Olen, Liu, Pilin, Goyal, Deepak
Published in Journal of electronic materials (01.03.2017)
Published in Journal of electronic materials (01.03.2017)
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Journal Article
A hybrid approach to characterize adhesion strength of interfaces in an organic substrate
Penmecha, Bharat, Alazar, Tsgereda, Seneviratne, Dilan, Pilin Liu, Malatkar, Pramod
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes
Hyunchul Kim, Mu Zhang, Kumar, C.M., Daewoong Suh, Pilin Liu, Dongwook Kim, Mayue Xie, Zhiyong Wang
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
The mechanism and kinetic study of void migration in Cu vias under current flow by 3D X-ray computed tomography
Yan Li, Luhua Xu, Pilin Liu, Pathangey, Balu, Pacheco, Mario, Hossain, Mohammad, Liang Hu, Dias, Rajen, Goyal, Deepak
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Enabling Hybrid Bonding on Intel Process
Elsherbini, Adel, Jun, Kimin, Vreeland, Richard, Brezinski, William, Niazi, Haris Khan, Shi, Yi, Yu, Qiang, Qian, Zhiguo, Xu, Jessica, Liff, Shawna, Swan, Johanna, Yao, Jimin, Liu, Pilin, Pelto, Christopher, Rami, Said, Balankutty, Ajay, Fischer, Paul, Turkot, Bob
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
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Conference Proceeding