Modeling and Analysis of Spike Signal Sequence for Memristor Crossbar Array in Neuromorphic Chips
Tao, Tuomin, Ma, Hanzhi, Li, Da, Li, Yan, Tan, Shurun, Liu, En-Xiao, Schutt-Aine, Jose, Li, Er-Ping
Published in IEEE transactions on circuits and systems. I, Regular papers (01.06.2023)
Published in IEEE transactions on circuits and systems. I, Regular papers (01.06.2023)
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Journal Article
Modeling and Signal Integrity Analysis of RRAM-Based Neuromorphic Chip Crossbar Array Using Partial Equivalent Element Circuit (PEEC) Method
Li, Yan, Fang, Lidan, Tao, Tuomin, Li, Da, Liu, En-Xiao, Jin, Ning, Ahmed, Manareldeen, Li, Er-Ping
Published in IEEE transactions on circuits and systems. I, Regular papers (01.09.2022)
Published in IEEE transactions on circuits and systems. I, Regular papers (01.09.2022)
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Journal Article
Circuit Modeling for RRAM-Based Neuromorphic Chip Crossbar Array With and Without Write-Verify Scheme
Tao, Tuomin, Ma, Hanzhi, Chen, Quankun, Gu, Zhe-Ming, Jin, Hang, Ahmed, Manareldeen, Tan, Shurun, Wang, Aili, Liu, En-Xiao, Li, Er-Ping
Published in IEEE transactions on circuits and systems. I, Regular papers (01.05.2021)
Published in IEEE transactions on circuits and systems. I, Regular papers (01.05.2021)
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Journal Article
Sex differences in correlates of suicide attempts in Chinese Han first‐episode and drug‐naïve major depressive disorder with comorbid subclinical hypothyroidism: A cross‐sectional study
Tian, Xue, Liu, Xiao‐En, Bai, Fengfeng, Li, Meijuan, Qiu, Yuying, Jiao, Qingyan, Li, Jie, Zhang, Xiang‐Yang
Published in Brain and behavior (01.06.2024)
Published in Brain and behavior (01.06.2024)
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Journal Article
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects
Er-Ping Li, Xing-Chang Wei, Cangellaris, Andreas C, En-Xiao Liu, Yao-Jiang Zhang, D'Amore, Marcello, Joungho Kim, Sudo, Toshio
Published in IEEE Transactions on Electromagnetic Compatibility (01.05.2010)
Published in IEEE Transactions on Electromagnetic Compatibility (01.05.2010)
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Book Review
Journal Article
Electromagnetic Characteristics of Multiport TSVs Using L-2L De-Embedding Method and Shielding TSVs
Li, Yong-Sheng, Li, Yan, Min, Qiu, Wu, Ke, Liu, En-Xiao, Hao, Ran, Chen, Hong-Sheng, Zhuo, Cheng, Yin, Wen-Yan, Wang, Zhe-Yao, Yu, Hui-Chun, Li, Er-Ping
Published in IEEE transactions on electromagnetic compatibility (01.10.2017)
Published in IEEE transactions on electromagnetic compatibility (01.10.2017)
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Journal Article