InFO (Wafer Level Integrated Fan-Out) Technology
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Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications
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Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
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Conference Proceeding
Journal Article
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Year of Publication 07.06.2021
Patent
SEMICONDUCTOR PACKAGE AND METHOD
LIU CHUNG SHI, YU CHEN HUA, HSIEH CHING HUA, CHUNG PHILIP YU SHUAN, PEI HAO JAN, CHENG CHIA SHEN, HUANG KUEI WEI, LIN HSIU JEN, CHEN WEI YU
Year of Publication 30.03.2022
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Year of Publication 30.03.2022
Patent
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
LIU CHUNG SHI, YU CHEN HUA, LAI YU CHIA, HSIEH CHENG CHIEH, TSAI HAO YI, KUO TIN HAO
Year of Publication 26.03.2021
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Year of Publication 26.03.2021
Patent