Maximizing Spectral Radii of Uniform Hypergraphs with Few Edges
Fan, Yi-Zheng, Tan, Ying-Ying, Peng, Xi-Xi, Liu, An-Hong
Published in Discussiones Mathematicae. Graph Theory (01.11.2016)
Published in Discussiones Mathematicae. Graph Theory (01.11.2016)
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Journal Article
Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm
LIU, De-Shin, CHANG, Chi-Min, TU, Chin-Yi, LIU, An-Hong, HUANG, Cheng-Fang, LEE, Yi-Chang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2011)
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Journal Article
An experimental and numerical investigation into the effects of the chip-on-film (COF) processing parameters on the Au-Sn bonding temperature
Liu, De-Shin, Yeh, Shu-Shen, Kao, Chun-Teh, Huang, Pay-Yau, Tsai, Chia-I, Liu, An-Hong, Ho, Shu-Ching
Published in Soldering & surface mount technology (01.01.2010)
Published in Soldering & surface mount technology (01.01.2010)
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Journal Article
Periodic Pulse Reverse Cu Plating for Through-Hole Filling
Shen, Fang-Yu, Dow, Wei-Ping, Liu, An-Hong, Lin, Jing-Yuan, Chang, Ping-He, Huang, Su-Mei
Published in ECS electrochemistry letters (14.02.2013)
Published in ECS electrochemistry letters (14.02.2013)
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Journal Article
Characterization of fine-pitch solder bump joint and package warpage for low K high-pin-count flip-chip BGA through Shadow Moiré and Micro Moiré techniques
An-Hong Liu, Wang, David W., Hsiang-Ming Huang, Ming Sun, Muh-Ren Lin, Chonghua Zhong, Sheng-Jye Hwang, Hsuan-Heng Lu
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Study of warpage characteristics of molded stacked-die MCP using Shadow Moiré and Micro Moiré techniques
Wang, David W, Hsiang-Ming Huang, Shu-Ching Ho, An-Hong Liu, De-Shin Liu
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
RFID implementation in inventory management of wafer cassettes and probe cards in wafer testing houses
Lee, M., Huang, C.F., An-Hong Liu, Yi-Chang Lee
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
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Conference Proceeding
Effect of bonding temperature on eutectic interconnections in Chip-On-Film packages
De-Shin Liu, Shu-Shen Yeh, Chia-I Tsai, An-Hong Liu, Shu-Ching Ho
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
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Conference Proceeding
The effect of simvastatin on the regeneration of sciatic nerve with crush injury in rats
Li, Ai-ping, Zhao, Hui, Zhao, Zhi, Liu, Hong-an, Guo, Qin-hua, Li, Bo, Guo, Kun-feng, Guo, Miao, Sun, Chang-kai
Published in Zhongguo ying yong sheng li xue za zhi (01.05.2007)
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Published in Zhongguo ying yong sheng li xue za zhi (01.05.2007)
Journal Article
Drainage of a Partially Wetting Film: Dodecane on Silicon
Liu, An-Hong, Wayner, Peter C, Plawsky, Joel L
Published in Industrial & engineering chemistry research (1996)
Published in Industrial & engineering chemistry research (1996)
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Journal Article
The effect of acid on fast through-hole filling by Cu electroplating
Jhih-Jyun Yan, Liang-Chun Chang, Chun-Wei Lu, Wei-Ping Dow, An-Hong Liu, Wang, D. W.
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
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Conference Proceeding
Thermal performance study of next generation fine-pitch chip-on-film (COF) packages - A numerical study
De-Shin Liu, Shu-Shen Yeh, Chieh-Jung Lu, Chan-Wei Chang, Chen-Wei Hung, An-Hong Liu, Hung-Hsin Liu
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
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Conference Proceeding
Correlation between Shadow Moiré and Micro Moiré techniques through characterization of flip-chip BGA
An-Hong Liu, Wang, D. W., Hsiang-Ming Huang, Ming Sun, Muh-Ren Lin, Chonghua Zhong, Sheng-Jye Hwang, Hsuan-Heng Lu, Huy-Tien Bui, Shang-Shiuan Deng
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
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Conference Proceeding
Detection of Staphylococcus aureus in Dairy Food by Loop-mediated Isothermal Amplification
Xiao, Cheng, Yongxin, Wang, Hong, An, Juanjuan, Liu, Bo, Zhang, Zhen, Jia, Jian, Cheng
Published in Animal husbandry and feed science (01.06.2014)
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Published in Animal husbandry and feed science (01.06.2014)
Journal Article
Manic-depressive Psychosis as the Initial Symptom in Adult Siblings with Late-onset Combined Methylmalonic Aciduria and Homocystinemia, Cobalamin C Type
Wu, Li-Yong, An, Hong, Liu, Jia, Li, Jie-Ying, Han, Yue, Zhou, Ai-Hong, Wang, Fen, Jia, Jian-Ping
Published in Chinese medical journal (20.02.2017)
Published in Chinese medical journal (20.02.2017)
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Journal Article
Population-based survey of prevalence, causes, and risk factors for blindness and visual impairment in an aging Chinese metropolitan population
Hu, Jian-Yan, Yan, Liang, Chen, Yong-Dong, Du, Xin-Hua, Li, Ting-Ting, Liu, De-An, Xu, Dong-Hong, Huang, Yi-Min, Wu, Qiang
Published in International journal of ophthalmology (18.01.2017)
Published in International journal of ophthalmology (18.01.2017)
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Journal Article