by Jim-Wein Lin, Chun-Liang Lu, Chuang, H.-P, Kuo, F.-M, Jin-Wei Shi, Chen-Bin Huang, Ci-Ling Pan
Published in IEEE photonics technology letters (15.08.2012)

by Lin, Chien-Chung, Han, Hau-Vei, Chen, Hsin-Chu, Chen, Kuo-Ju, Tsai, Yu-Lin, Lin, Wein-Yi, Kuo, Hao-Chung, Yu, Peichen
Published in Journal of nanoscience and nanotechnology (01.02.2014)

by Lin, Jim-Wein, Wun, Jhih-Min, Shi, Jin-Wei, Pan, Ci-Ling
Published in Journal of infrared, millimeter and terahertz waves (01.10.2014)

by Jim-Wein Lin, Chuang, H.-P, Kuo, F.-M, Cheng-Han Lin, Tze-An Liu, Jin-Wei Shi, Chen-Bin Huang, Ci-Ling Pan
Published in IEEE photonics technology letters (01.07.2011)

by Chen, Nan-Kuang, Lin, Jim-Wein, Liu, Feng-Zhou, Liaw, Shien-Kuei
Published in IEEE photonics technology letters (15.05.2010)

by Chang, Chao-Sung, Lin, Kuan-Tsao, Chang, Jan-Gowth, Lin, Chin-Wein, Hsieh, Li-Ling, Yeh, Chi-Jung, Liu, Ta-Chih
Published in International journal of hematology (01.09.2008)

by Hau-Vei Han, Chien-Chung Lin, Wein-Yi Lin, Yu-Lin Tsai, Tien-Lin Shen, Hao-Chung Kuo, Peichen Yu
Published in 2014 IEEE 40th Photovoltaic Specialist Conference (PVSC) (01.06.2014)

by Chia-Hsin Lee, Su, Jay, Xiao Liu, Qi Wu, Jim-Wein Lin, Puru Lin, Cheng-Ta Ko, Yu-Hua Chen, Wen-Wei Shen, Tzu-Ying Kou, Shin-Yi Huang, Ang-Ying Lin, Yu-Min Lin, Kuan-Neng Chen
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Chen, Nan-Kuang, Liu, Feng-Zhou, Chuang, Hsiu-Po, Lai, Yinchieh, Yang, Shang-Da, Lin, Jim-Wein, Liaw, Shien-Kuei, Chang, Yu-Chung, Huang, Chen-Bin, Chi, Sien
Published in Optics express (15.08.2011)

by Jim-Wein Lin, De-Shiang Liu, Chen-Hao Lin, Chih-Lun Wang, Jui-Tang Chen, Cheng-Hsiung Wang, Chi-Hai Kuo, Kai-Ming Yang, Yin-Po Hung, Cheng-Ta Ko, Yu-Hua Chen
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)

by Cheng-Ta Ko, Kai-Ming Yang, Jim-Wein Lin, Chih-Lun Wang, Tzu-Chieh Chou, Yu-Tao Yang, Ting-Yang Yu, Yu-Hua Chen, Kuan-Neng Chen, Tzyy-Jang Tseng
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2017)

by LIN, WEIN
Year of Publication 01.12.2022

by LIN, WEIN
Year of Publication 16.02.2021

by LIN, WEIN
Year of Publication 01.02.2021

by LIN, WEIN
Year of Publication 01.01.2021

by LIN, WEIN
Year of Publication 16.02.2020

by LIN, WEIN
Year of Publication 01.01.2020

by LIN, WEIN
Year of Publication 01.09.2019

by LIN, WEIN
Year of Publication 01.09.2019

by LIN, WEIN
Year of Publication 16.02.2019