Colors only process to reduce package yield loss
CHU CHENG-YU, LI KUO-WEI, FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, FAN FU-JIER
Year of Publication 19.10.2010
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Year of Publication 19.10.2010
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Colors only process to reduce package yield loss
Fan, Yang-Tung, Peng, Chiou-Shian, Chu, Cheng-Yu, Lin, Shih-Jane, Chen, Yen-Ming, Fan, Fu-Jier, Li, Kuo-Wei
Year of Publication 19.10.2010
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Year of Publication 19.10.2010
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COLORS ONLY PROCESS TO REDUCE PACKAGE YIELD LOSS
CHU CHENG-YU, FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER
Year of Publication 30.04.2009
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Year of Publication 30.04.2009
Patent
Colors only process to reduce package yield loss
Fan, Yang-Tung, Peng, Chiou-Shian, Chu, Cheng-Yu, Lin, Shih-Jane, Chen, Yen-Ming, Fan, Fu-Jier, Lin, Kuo-Wei
Year of Publication 03.02.2009
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Year of Publication 03.02.2009
Patent
Colors only process to reduce package yield loss
CHU CHENG-YU, FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER
Year of Publication 03.02.2009
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Year of Publication 03.02.2009
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Colors only process to reduce package yield loss
FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER, CHU CHEN-YU
Year of Publication 31.05.2007
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Year of Publication 31.05.2007
Patent
Colors only process to reduce package yield loss
Fan, Yang-Tung, Peng, Chiou-Shian, Chu, Cheng-Yu, Lin, Shih-Jane, Chen, Yen-Ming, Fan, Fu-Jier, Lin, Kuo-Wei
Year of Publication 27.02.2007
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Year of Publication 27.02.2007
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Colors only process to reduce package yield loss
CHU CHENG-YU, FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER
Year of Publication 27.02.2007
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Year of Publication 27.02.2007
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Bumping process to increase bump height and to create a more robust bump structure
CHU CHENG-YU, FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER
Year of Publication 18.10.2005
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Year of Publication 18.10.2005
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Bumping process to increase bump height and to create a more robust bump structure
Fan, Yang-Tung, Chu, Cheng-Yu, Fan, Fu-Jier, Lin, Shih-Jane, Peng, Chiou-Shian, Chen, Yen-Ming, Lin, Kuo-Wei
Year of Publication 18.10.2005
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Year of Publication 18.10.2005
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Colors only process to reduce package yield loss
CHU CHENG-YU, FAN YANG-TUNG, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER, PENG CHION-SHIAN
Year of Publication 09.06.2005
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Year of Publication 09.06.2005
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Colors only process to reduce package yield loss
CHU CHENG-YU, FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER
Year of Publication 05.04.2005
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Year of Publication 05.04.2005
Patent
Colors only process to reduce package yield loss
Fan, Yang-Tung, Peng, Chiou-Shian, Chu, Cheng-Yu, Lin, Shih-Jane, Chen, Yen-Ming, Fan, Fu-Jier, Lin, Kuo-Wei
Year of Publication 05.04.2005
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Year of Publication 05.04.2005
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Manufacturing method of solid state image device with color filters only and CMOS, CCD image sensor
CHU, CHENG-YU, PENG, CHIOU-SHIAN, FAN, YANG-TUNG, CHEN, YEN-MING, LIN, SHIH-JANE
Year of Publication 21.07.2002
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Year of Publication 21.07.2002
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Bumping process to increase bump height and to create a more robust bump structure
CHU CHENG-YU, FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER
Year of Publication 08.01.2004
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Year of Publication 08.01.2004
Patent
Bumping process to increase bump height and to create a more robust bump structure
Chu, Cheng-Yu, Fan, Yang-Tung, Fan, Fu-Jier, Lin, Shih-Jane, Peng, Chiou-Shian, Chen, Yen-Ming, Lin, Kuo-Wei
Year of Publication 08.01.2004
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Year of Publication 08.01.2004
Patent
Dual layer photoresist method for fabricating a mushroom bumping plating structure
Chen, Yen-Ming, Chu, Cheng-Yu, Lin, Kuo-Wei, Peng, Chiou-Shian, Fan, Yang-Tung, Fan, Fu-Jier, Lin, Shih-Jane
Year of Publication 18.11.2003
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Year of Publication 18.11.2003
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Dual layer photoresist method for fabricating a mushroom bumping plating structure
CHU CHENG-YU, FAN YANG-TUNG, PENG CHIOU-SHIAN, CHEN YEN-MING, LIN SHIH-JANE, LIN KUO-WEI, FAN FU-JIER
Year of Publication 18.11.2003
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Year of Publication 18.11.2003
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Method to form a color image sensor cell while protecting the bonding pad structure from damage
CHU CHENG-YU, FAN YANG-TUNG, PENG CHIOU-SHIAN, LIN SHIH-JANE, CHEN YEN-MING, LIN KUO-WEI, FAN FU-JIER
Year of Publication 14.10.2003
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Year of Publication 14.10.2003
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Method to form a color image sensor cell while protecting the bonding pad structure from damage
Fan, Yang-Tung, Chu, Cheng-Yu, Peng, Chiou-Shian, Lin, Shih-Jane, Chen, Yen-Ming, Fan, Fu-Jier, Lin, Kuo-Wei
Year of Publication 14.10.2003
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Year of Publication 14.10.2003
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