Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications
Lee, Tzu-Nien, Lau, John-H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru-Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia-Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in Materials (24.03.2022)
Published in Materials (24.03.2022)
Get full text
Journal Article
Fabrication and Characterization of a Three-Dimensional Flexible Thermopile
Lin, Puru, Wu, Ching-Yi, Cheng, Yung-Ming, Lin, Yuh-Jiuan, Huang, Fon-Shan, Huang, Star Ruey-Shing
Published in Japanese Journal of Applied Physics (01.03.2008)
Published in Japanese Journal of Applied Physics (01.03.2008)
Get full text
Journal Article
Characterization of Low Loss Dielectric Materials for High-Speed and High-Frequency Applications
Lee, Tzu Nien, Lau, John H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging
Chia-Hsin Lee, Su, Jay, Xiao Liu, Qi Wu, Jim-Wein Lin, Puru Lin, Cheng-Ta Ko, Yu-Hua Chen, Wen-Wei Shen, Tzu-Ying Kou, Shin-Yi Huang, Ang-Ying Lin, Yu-Min Lin, Kuan-Neng Chen
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Get full text
Conference Proceeding
A PoP structure to support I/O over 2000
Dyi-Chung Hu, Puru Lin, Yu Hua Chen, Chun-Ting Lin
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Get full text
Conference Proceeding
Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration
Lau, John H., Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, J. J., Huang, Patrick Po-Chun, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Lin, Eagle, Chang, Leo
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)
Get full text
Journal Article
Fan-Out Panel-Level Packaging of Mini-LED RGB Display
Lau, John H., Ko, Cheng-Ta, Lin, Curry, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Peng, Chia-Yu, Lin, Eagle, Chang, Leo, Liu, Ning, Chiu, Show May, Lee, Tzu Nien
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
Get full text
Journal Article
Panel-Level Chip-Scale Package With Multiple Diced Wafers
Lau, John H., Ko, Cheng-Ta, Tseng, Tzyy-Jang, Yang, Kai-Ming, Peng, Tony Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, David
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)
Get full text
Journal Article
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
Lau, John H., Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.07.2020)
Published in Journal of microelectronics and electronic packaging (01.07.2020)
Get full text
Journal Article
Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration
Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Fan, Yan-Jun, Liu, Hsing-Ning, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.04.2021)
Published in Journal of microelectronics and electronic packaging (01.04.2021)
Get full text
Journal Article
Six-Side Molded Panel-Level Chip-Scale Package with Multiple Diced Wafers
Lau, John H., Ko, Cheng-Ta, Tseng, Tzvy-Jang, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Cheng, David, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.10.2020)
Published in Journal of microelectronics and electronic packaging (01.10.2020)
Get full text
Journal Article
Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)
Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Fan, Yan-Jun, Cheng, David, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.04.2021)
Published in Journal of microelectronics and electronic packaging (01.04.2021)
Get full text
Journal Article
Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration
Lau, John H., Lin, Curry, Liu, Hsing-Ning, Yang, Kai-Ming, Xia, Tim, Ko, Cheng-Ta, Lin, Bruce Puru, Chuang, Yu-Ling, Chen, R., Ma, M., Tseng, Tzyy-Jang, Li, Ming, Leung, K.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2023)
Get full text
Journal Article
Development of High-Density Hybrid Substrate for Heterogeneous Integration
Peng, Chia-Yu, Lau, John H, Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Henry Kai-Ming, Lin, Puru Bruce, Xia, Tim, Chang, Leo, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
Get full text
Conference Proceeding
High-Density Hybrid Substrate for Heterogeneous Integration
Peng, Tony Chia-Yu, Lau, John H., Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Kai-Ming, Lin, Bruce Puru, Xia, Tim, Chang, Leo, Liu, Hsing-Ning, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
Get full text
Journal Article
Reliability of 6-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)
Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Fan, Yan-Jun, Cheng, David, Lu, Winnie
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Get full text
Conference Proceeding