Characterization of Low Loss Dielectric Materials for 5G Applications
Lee, Tzu Nien, Lau, John H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Henry Kai-Ming, Lin, Puru Bruce, Peng, Tony Chia-Yu, Chang, Leo, Chen, Jia Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
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Conference Proceeding
A Novel Warpage Reinforcement Architecture with RDL Interposer for Heterogeneous Integrated Packages
Peng, Chia-Yu, Lin, Puru Bruce, Ko, Cheng-Ta, Wang, Chi-Wei, Chuang, Oscar, Lee, Chang-Chun
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Reliability of Chip-Last Fan-Out Panel-Level Packaging for Heterogeneous Integration
Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Fan, Yan-Jun, Liu, Hsing-Ning, Lu, Winnie
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Design, Materials, Process, Fabrication, and Reliability of Mini-LED RGB Display by Fan-Out Panel-Level Packaging
Lau, John H, Ko, Cheng-Ta, Lin, Curry, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Peng, Chia-Yu, Lin, Eagle, Chang, Leo, Liu, Ning, Chiu, Show May, Lee, Tzu Nien
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Comprehensive Investigation on Warpage Management of FOPLP with Multi Embedded Ring Designs
Lee, Chang-Chun, Liou, Yan-Yu, Huang, Pei-Chen, Hsu, Fussen, Lin, Puru Bruce, Ko, Cheng-Ta, Chen, Yu-Hua
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Fine trace substrate with 2µm fine line for advanced package
Dyi-Chung Hu, Puru Lin, Yu Hua Chen
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
A Comprehensive Study on Stress and Warpage by Design, Simulation and Fabrication of RDL-First Panel Level Fan-Out Technology for Advanced Package
Lin, Puru Burce, Cheng-Ta Ko, Wei-Tse Ho, Chi-Hai Kuo, Kuan-Wen Chen, Yu-Hua Chen, Tzyy-Jang Tseng
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Fan-Out RDL-first Panel-Level Packaging for Heterogeneous Integration
Lau, John H, Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, JJ, Huang, Po-Chun, Liu, Hsing Ning, Tseng, Tzvy-Jang
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications
Lin, Yu-Min, Wu, Sheng-Tsai, Wang, Chun-Min, Lee, Chia-Hsin, Huang, Shin-Yi, Lin, Ang-Ying, Chang, Tao-Chih, Lin, Puru Bruce, Ko, Cheng-Ta, Chen, Yu-Hua, Su, Jay, Liu, Xiao, Prenger, Luke, Chen, Kuan-Neng
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Fan-In Panel-Level with Multiple Diced Wafers Packaging
Lau, John H, Ko, Cheng-Ta, Tseng, Tzvy-Jang, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, David
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Innovated ultra-thin and super fine-pitch panel RDL substrate manufacturing for advanced package
Yu-Hua Chen, Lin, Puru Bruce, Cheng-Ta Ko, Tzyy-Jang Tseng
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding