Thermal stability, adhesion and electrical studies on (Ti,Zr)Nx thin films as low resistive diffusion barriers between Cu and Si
Huang, Cheng-Lin, Lai, Chih-Huang, Tsai, Po-Hao, Kuo, Yu-Lin, Lin, Jing-Cheng, Lee, Chiapyng
Published in Electronic materials letters (2014)
Published in Electronic materials letters (2014)
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Journal Article
Association between the M235T polymorphism of the AGT gene and cytokines in patients with hypertension
CHENG, JING-LIN, WANG, AI-LING, WAN, JUN
Published in Experimental and therapeutic medicine (01.03.2012)
Published in Experimental and therapeutic medicine (01.03.2012)
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Journal Article
High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration
Liu, C. C., Shuo-Mao Chen, Feng-Wei Kuo, Huan-Neng Chen, En-Hsiang Yeh, Cheng-Chieh Hsieh, Li-Hsien Huang, Ming-Yen Chiu, Yeh, J., Tsung-Shu Lin, Tzu-Jin Yeh, Shang-Yun Hou, Jui-Pin Hung, Jing-Cheng Lin, Chewn-Pu Jou, Chuei-Tang Wang, Shin-Puu Jeng, Yu, D. C. H.
Published in 2012 International Electron Devices Meeting (01.12.2012)
Published in 2012 International Electron Devices Meeting (01.12.2012)
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Conference Proceeding
Characterization of tantalum nitride films deposited by reactive sputtering of Ta in N2/Ar gas mixtures
LEE, Wen-Horng, LIN, Jing-Cheng, LEE, Chiapyng
Published in Materials chemistry and physics (15.02.2001)
Published in Materials chemistry and physics (15.02.2001)
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Journal Article
Growth, Thermal Stability and Cu Diffusivity of Reactively Sputtered NbN Thin Films as Diffusion Barriers between Cu and Si
Huang, Cheng-Lin, Lai, Chih-Huang, Tsai, Po-Hao, Huang, Hsing-An, Lin, Jing-Cheng, Lee, Chiapyng
Published in ECS journal of solid state science and technology (01.01.2013)
Published in ECS journal of solid state science and technology (01.01.2013)
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Journal Article
Interdiffusion and reactions in the Cu/TiN/Si thin film system
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Journal Article
Conference Proceeding