EMMI Abnormal Hotspot Study for Latch up Simulation
Chia-Sheng, Huang, Xuan-Chao, Guo, Zhi-Wei, Chen, shin-chia, Lin, Sheng-Ru, Zhang, Bo-an, Tsai
Published in 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2019)
Published in 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2019)
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Conference Proceeding
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Year of Publication 18.04.2023
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Year of Publication 18.04.2023
Patent
노치된 (notch) 웨이퍼들을 프로세싱하기 위한 플라즈마-배제-존 (plasma-exclusion-zone) 링들
ZHANG DAN, AMBUROSE GNANAMANI, CHEN JACK, HUA XUEFENG, HUANG CHANG WEI, LIN CHIA SHIN
Year of Publication 05.12.2022
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Year of Publication 05.12.2022
Patent
Case study of embedded memory failure analysis for dislocation issue
Cheng Wei Tang, Shin Chia Lin, Yi Chen Lin, Mei Ying Hsiao, Yau Shan Wu, Chi Lin
Published in Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.06.2014)
Published in Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.06.2014)
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Conference Proceeding
PLASMA-EXCLUSION-ZONE RINGS FOR PROCESSING NOTCHED WAFERS
HUA, Xuefeng, LIN, Chia-Shin, HUANG, Chang-Wei, ZHANG, Dan, AMBUROSE, Gnanamani, CHEN, Jack
Year of Publication 02.11.2023
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Year of Publication 02.11.2023
Patent
WAFER EDGE DEPOSITION FOR WAFER LEVEL PACKAGING
Keovisai, Chanthavisa, Chen, Jack, Latchford, Ian Scot, Hua, Xuefeng, Lin, Chia-Shin
Year of Publication 05.10.2023
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Year of Publication 05.10.2023
Patent
WAFER EDGE DEPOSITION FOR WAFER LEVEL PACKAGING
HUA, Xuefeng, LIN, Chia-Shin, LATCHFORD, Ian Scot, KEOVISAI, Chanthavisa, CHEN, Jack
Year of Publication 24.02.2022
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Year of Publication 24.02.2022
Patent
PLASMA-EXCLUSION-ZONE RINGS FOR PROCESSING NOTCHED WAFERS
HUA, Xuefeng, LIN, Chia-Shin, HUANG, Chang-Wei, ZHANG, Dan, AMBUROSE, Gnanamani, CHEN, Jack
Year of Publication 30.09.2021
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Year of Publication 30.09.2021
Patent