Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit Analysis
Lai, Jung-Pin, Lin, Ying-Lei, Lin, Ho-Chuan, Shih, Chih-Yuan, Wang, Yu-Po, Pai, Ping-Feng
Published in Micromachines (Basel) (20.01.2023)
Published in Micromachines (Basel) (20.01.2023)
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Journal Article
RLC Circuit Forecast in Analog IC Packaging and Testing by Machine Learning Techniques
Lai, Jung-Pin, Lin, Ying-Lei, Lin, Ho-Chuan, Shih, Chih-Yuan, Wang, Yu-Po, Pai, Ping-Feng
Published in Micromachines (Basel) (01.08.2022)
Published in Micromachines (Basel) (01.08.2022)
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Journal Article
An Experimental and Numerical Study on Supported Ultra-Lean Methane Combustion
Lin, Ho-Chuan, Chen, Guan-Bang, Wu, Fang-Hsien, Li, Hong-Yeng, Chao, Yei-Chin
Published in Energies (Basel) (06.06.2019)
Published in Energies (Basel) (06.06.2019)
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Journal Article
Machine Learning in Integrated Circuit Substrate Electrical Test (IMPACT 2023)
Lai, Jung-Pin, Lin, Ying-Lei, Liu, Yu-Hui, Lin, Ho-Chuan, Shih, Chih-Yuan, Wang, Yu-Po, Pai, Ping-Feng
Published in 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (25.10.2023)
Published in 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (25.10.2023)
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Conference Proceeding
High Speed SerDes Design on Flip Chip Package Substrate
Zhuang, Ming-Han, Lai, Chia-Chu, Lin, Ho-Chuan, Shih, Chih Yuan, Kang, Andrew, Wang, Yu-Po
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
High Speed Signal Design on Fan-Out RDL Interposer for Artificial Intelligence (AI) and Deep Neural Network (DNN) Chiplet Accelerators Application
Zhuang, Ming-Han, Shih, Chih-Yuan, Lin, Ho-Chuan, Kang, Andrew, Wang, Yu-Po
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding
On-wafer probing measurement and optimization of MIM capacitors for integrated passive device application
Ho-chuan Lin, Ming-Fan Tsai, Lee, Daniel
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
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Conference Proceeding
WiFi SiP module using IPD Rx Balun applications
Min-Han Chuang, Chia-Chu Lai, Ho-Chuan Lin, Ming-Fan Tsai, Chen, Camus, Yang, Erico, Lee, Daniel
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
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Conference Proceeding