by Sanming Hu, Yong-Zhong Xiong, Bo Zhang, Lei Wang, Teck-Guan Lim, Minkyu Je, Madihian, M.
Published in IEEE journal of solid-state circuits (01.11.2012)

by Sun, Mei, Guan Lim, Teck, Soon Wee Ho, David, Wu, Jiaqi, Chai, Tai Chong, Ma, Yugang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)

by Chu, Hui, Guo, Yong-Xin, Lim, Teck-Guan, Khoo, Yee Mong, Shi, Xiangquan
Published in IEEE transactions on antennas and propagation (01.10.2012)

by Hu, Sanming, Xiong, Yong-Zhong, Wang, Lei, Li, Rui, Shi, Jinglin, Lim, Teck-Guan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2012)

by Wang, Lei, Xiong, Yong-Zhong, Zhang, Bo, Hu, San-Ming, Lim, Teck-Guan, Yuan, Xiao-Jun
Published in Journal of infrared, millimeter and terahertz waves (01.10.2010)

by LIU, En-Xiao, LI, Er-Ping, EWE, Wei-Bin, HUI MIN LEE, TECK GUAN LIM, SHAN GAO
Published in IEEE transactions on microwave theory and techniques (01.06.2011)

by LEI WANG, XIONG, Yong-Zhong, BO ZHANG, HU, San-Ming, LIM, Teck-Guan
Published in IEEE transactions on microwave theory and techniques (01.05.2011)

by Lim, Teck-Guan, Ang, Hwee-Ngoh, Robertson, Ian D., Weiss, Bernard L.
Published in Microwave and optical technology letters (01.10.2006)

by Li, Rui, Jin, Cheng, Ong, Siong Chiew, Lim, Teck Guan, Chang, Ka Fai, Ho, Soon Wee
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2013)

by Hu, Sanming, Wang, Lei, Xiong, Yong-Zhong, Lim, Teck Guan, Zhang, Bo, Shi, Jinglin, Yuan, Xiaojun
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)

by Li, Rui, Lim, Teck Guan, Ho, Soon Wee
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2012)

by Kawano, Masaya, Chum-Mei Wang, Hong-Yu Li, Mian-Zhi Ding, Lim, Sharon Pei-Siang, Teck-Guan Lim, Zi-Hao Chen, Fa-Xing Che
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Wang, Lei, Xiong, Yong-Zhong, Zhang, Bo, Hu, San-Ming, Lim, Teck-Guan
Published in IEEE transactions on microwave theory and techniques (01.05.2011)

by Zhang, Bo, Xiong, Yong-Zhong, Wang, Lei, Hu, Sanming, Lim, Teck-Guan, Zhuang, Yi-Qi, Li, Le-Wei
Published in Electromagnetic waves (Cambridge, Mass.) (2010)

by Mei, Sun, Guan, Lim Teck, Lin, Zhou
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)

by Khoo, Yee Mong, Lim, Teck Guan, Ho, Soon Wee, Li, Rui, Xiong, Yong-Zhong, Zhang, Xiaowu
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2012)

by Wai, Leong Ching, Guan Lim, Teck, Chong, Ser Choong, Zhou, Lin
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)

by Chen Zihao, Lim Teck Guan, Ho, David Soon Wee, Bhattacharya, Surya
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Wu, Jiaqi, Lim, Teck Guan, Gourikutty, Sajay Bhuvanendran Nair, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

by Lin, Zhou, Guan, Lim Teck, Jiaqi, Wu, Feng, Xu, Chinq, Jong Ming, Chyn, Ng Yong
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)