A 0.13-μm HBT divide-by-6 injection-locked frequency divider
Lei Wang, Yong-Zhong Xiong, San-Ming Hu, Teck-Guan Lim
Published in IEEE Asian Solid-State Circuits Conference 2011 (01.11.2011)
Published in IEEE Asian Solid-State Circuits Conference 2011 (01.11.2011)
Get full text
Conference Proceeding
77-GHz Automotive Radar Sensor System With Antenna Integrated Package
Chang, Ka Fai, Li, Rui, Jin, Cheng, Lim, Teck Guan, Ho, Soon Wee, Hwang, How Yuan, Zheng, Boyu
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2014)
Get full text
Journal Article
A millimeter-wave wideband high-gain antenna and its 3D system-in-package solution in a TSV-compatible technology
Sanming Hu, Yong-Zhong Xiong, Lei Wang, Rui Li, Teck Guan Lim
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Get full text
Conference Proceeding
A low-cost high-gain antenna array and its integration with active circuits
Sanming Hu, Yong Zhong Xiong, Lei Wang, Debin Hou, Teck Guan Lim
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Get full text
Conference Proceeding
High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)
Ying Ying Lim, Xianghua Xiao, Vempati, Srinivasa Rao, Su, Nandar, Kumar, Aditya, Sharma, Gaurav, Teck Guan Lim, Vaidyanathan, Kripesh, Jinglin Shi, Lau, John H, Shiguo Liu
Published in IEEE transactions on advanced packaging (01.11.2010)
Published in IEEE transactions on advanced packaging (01.11.2010)
Get full text
Journal Article
Design of wideband bandpass filters using Si-BCB technology for millimeter-wave applications
Rui Li, Teck Guan Lim, Soon Wee Ho, Yong Zhong Xiong, Pinjala, Damaruganath
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Get full text
Conference Proceeding
Wideband bandpass filter design for D-band application
Rui Li, Teck Guan Lim, Soon Wee Ho, Yong Zhong Xiong, Yee Mong Khoo
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Get full text
Conference Proceeding
Millimeter-Wave Frequency Doubler With Transistor Grounded-Shielding Structure in hbox 0.13 - mu hbox m SiGe BiCMOS Technology
Wang, Lei, Xiong, Yong-Zhong, Zhang, Bo, Hu, San-Ming, Lim, Teck-Guan
Published in IEEE transactions on microwave theory and techniques (01.05.2011)
Published in IEEE transactions on microwave theory and techniques (01.05.2011)
Get full text
Journal Article
Millimeter-Wave Frequency Doubler With Transistor Grounded-Shielding Structure in [Formula Omitted] SiGe BiCMOS Technology
Wang, Lei, Xiong, Yong-Zhong, Zhang, Bo, Hu, San-Ming, Lim, Teck-Guan
Published in IEEE transactions on microwave theory and techniques (01.05.2011)
Published in IEEE transactions on microwave theory and techniques (01.05.2011)
Get full text
Journal Article
130-GHz gain-enhanced SiGe low noise amplifier
Bo Zhang, Yong-Zhong Xiong, Lei Wang, Sanming Hu, Teck Guan Lim, Yi-Qi Zhuang, Le-Wei Li, Xiaojun Yuan
Published in 2010 IEEE Asian Solid-State Circuits Conference (01.11.2010)
Published in 2010 IEEE Asian Solid-State Circuits Conference (01.11.2010)
Get full text
Conference Proceeding
Dual Polarized FOWLP AiP for 5G Base Station Applications
Mei, Sun, Guan, Lim Teck
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Get full text
Conference Proceeding
A novel compact antenna with a low profile demonstrated on embedded wafer level packaging (EMWLP) technology
Lim Ying Ying, David, H. S. W., Chong Ser Choong, Myo Ei Pa Pa, Lim Teck Guan
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Get full text
Conference Proceeding
Millimeter-wave/THz passive components design using through silicon via (TSV) technology
Sanming Hu, Lei Wang, Yong-Zhong Xiong, Jinglin Shi, Bo Zhang, Dan Zhao, Teck Guan Lim, Xiaojun Yuan
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Get full text
Conference Proceeding
Lange coupler design for Si-ICs up to 170GHz in 0.13um SiGe BiCMOS
Lei Wang, Yong-Zhong Xiong, Bo Zhang, Lim Teck-Guan, Xiaojun Yuan
Published in 2009 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) (01.12.2009)
Published in 2009 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) (01.12.2009)
Get full text
Conference Proceeding
THz-wave propagation characteristics of TSV-based transmission lines and interconnects
Sanming Hu, Yong-Zhong Xiong, Jinglin Shi, Lei Wang, Bo Zhang, Dan Zhao, Teck Guan Lim, Xiaojun Yuan
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Get full text
Conference Proceeding
Thermal Challenges and Design Considerations in Heterogeneous Integrated Through-Silicon-interposer Platform for III-V HEMT Flip Chip
Chen, Haoran, Lim, Teck Guan, Tang, Gongyue
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
135-GHz co-planar patch array on BCB/silicon with polymer-filled cavity
Siew Bee Yeap, Zhi Ning Chen, Li Rui, Ho, D S W, Lim Teck Guan
Published in 2011 International Workshop on Antenna Technology (iWAT) (01.03.2011)
Published in 2011 International Workshop on Antenna Technology (iWAT) (01.03.2011)
Get full text
Conference Proceeding
FOWLP AiP for SOTM Applications
Mei, Sun, Guan, Lim Teck, Yong, Han
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding