WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACUTRING THE SAME
KIM WOO YOUNG, LIM KYEONG BIN, RHEE MIN WOO, MOON BUM KI, HAHN SEUNG HO
Year of Publication 30.09.2024
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Year of Publication 30.09.2024
Patent
SUBSTRATE BONDING METHOD
PHEE JAE HYUN, LIM KYEONG BIN, RHEE MIN WOO, YOON SUNG YOUNG, MOON BUM KI, CHOI WON YOUNG
Year of Publication 08.05.2024
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Year of Publication 08.05.2024
Patent
SEMICONDUCTOR PROCESSING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
PARK SUN WOO, KANG SU JIE, LIM KYEONG BIN, LEE HYUN JIN, RHEE MIN WOO, MOON BUM KI, LEE SEUNG DON
Year of Publication 27.08.2024
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Year of Publication 27.08.2024
Patent
NON-CONTACT TYPE GRIPPER
KIM JU NO, LIM KYEONG BIN, MIN DAE HO, ONO KAZUYA, RHEE MIN WOO, LEE KANG SAN
Year of Publication 08.05.2024
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Year of Publication 08.05.2024
Patent
Die bonding apparatus
KIM JU NO, KANG SU JIE, LIM KYEONG BIN, MIN DAE HO, HAN IL YOUNG, RHEE MIN WOO, KIM SU MIN
Year of Publication 10.06.2024
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Year of Publication 10.06.2024
Patent
DIE ALIGNMENT METHOD USING MAGNETIC FORCE
LIM KYEONG BIN, SHIN YONG CHUL, HAN IL YOUNG, RHEE MIN WOO, LEE SEUNG DON, KIM SU MIN, HONG NUNG PYO
Year of Publication 15.06.2023
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Year of Publication 15.06.2023
Patent
A semiconductor device an apparatus for manufacturing the semiconductor device and a method for manufacturing the semiconductor device using the apparatus
LIM KYEONG BIN, LEE MIN WOO, SHIN YONG CHUL, HAN IL YOUNG, LEE SEUNG DON, KIM SU MIN, HONG NUNG PYO
Year of Publication 14.06.2023
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Year of Publication 14.06.2023
Patent
CHIP BONDING APPARATUS
LEE JOONG HA, KIM SUNG HYUP, LIM KYEONG BIN, PARK SANG HA, KIM JUN HYUNG
Year of Publication 28.12.2021
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Year of Publication 28.12.2021
Patent
SUBSTRATE BONDING APPARATUS
HAN MIN SOO, LIM KYEONG BIN, KIM JUN HYUNG, RHEE MIN WOO, CHANG IN BAE
Year of Publication 12.04.2021
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Year of Publication 12.04.2021
Patent
WAFER TO WAFER BONDING METHOD AND WAFER TO WAFER BONDING APPARATUS
YUN HYEON JUN, JO GWANG HEE, HAN MIN SOO, LIM KYEONG BIN, KIM JUN HYUNG, SEOK SEUNG DAE, LEE JE WON
Year of Publication 12.01.2021
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Year of Publication 12.01.2021
Patent
Substrate bonding apparatus and method of bonding a pair of substrates using the same
KIM SUNG HYUP, LIM KYEONG BIN, KIM SEOK HO, KIM JUN HYUNG, KIM TAE YEONG
Year of Publication 26.06.2019
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Year of Publication 26.06.2019
Patent
Semiconductor device and manufacturing method thereof
KIM HYO JU, KIM SUNG HYUP, LIM KYEONG BIN, LEE HO CHANG, NA JEONG MIN
Year of Publication 22.01.2020
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Year of Publication 22.01.2020
Patent
Behavior planning of an unmanned ground vehicle with actively articulated suspension to negotiate geometric obstacles
Kyeong Bin Lim, Sukhoon Park, Suengwoo Kim, Jae Muk Jeong, Yong-San Yoon
Published in 2009 IEEE/RSJ International Conference on Intelligent Robots and Systems (01.10.2009)
Published in 2009 IEEE/RSJ International Conference on Intelligent Robots and Systems (01.10.2009)
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Conference Proceeding
WELDING CARRIAGE FOR LATTICE STRUCTURE
SHIN, SANG RYONG, LIM, KYEONG BIN, KIM, JAE GWON, PARK, SEUNG GYU, KIM, JONG JUN
Year of Publication 08.10.2014
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Year of Publication 08.10.2014
Patent
AUTOMATIC WELDING APPARATUS
LIM, KYEONG BIN, SHIN, SANG RYONG, PARK, SEUNG GYU, KIM, JI ON, KIM, JONG JUN
Year of Publication 29.05.2014
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Year of Publication 29.05.2014
Patent