Die attach materials impacts to copper wire bonding: New challenges
Lim Fui Yee, Yew, C. L. W.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Culture Shock and Adaptation Strategies of Indonesian Migrant Workers in the Japanese Agriculture Field
Srimulyani, Nunuk Endah, Yee, Beatrice Lim Fui
Published in The international journal of social sustainability in economic, social and cultural context (Print) (2024)
Published in The international journal of social sustainability in economic, social and cultural context (Print) (2024)
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Journal Article
High thermal performance ICP die attach process design and development for LQFP-EP
Lim Fui Yee, Khoo Ly Hoon, Tiu Kong Bee, Yow Kai Yun
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
The Comparison of Perceptions of the Economic Impact of COVID-19 and the 2015 Ranau Earthquake among Homestay Entrepreneurs in Kundasang, Sabah
Mahmud, Roslinah, Pazim, Khairul Hanim, Yee, Beatrice Lim Fui, Mansur, Kasim, Abdullah, Borhan, Boroh, Rostika Petrus
Published in International journal of academic research in business and social sciences (24.03.2022)
Published in International journal of academic research in business and social sciences (24.03.2022)
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Journal Article
LOW-STRESS THERMAL INTERFACE
Viswanathan, Lakshminarayan, Kishore, Sharan, Molla, Jaynal A, Lim, Fui Yee, Li, Lu, van Straten, Freek Egbert
Year of Publication 03.07.2024
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Year of Publication 03.07.2024
Patent
LOW-STRESS THERMAL INTERFACE
Viswanathan, Lakshminarayan, Kishore, Sharan, Molla, Jaynal A, Lim, Fui Yee, Li, Lu, van Straten, Freek Egbert
Year of Publication 27.06.2024
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Year of Publication 27.06.2024
Patent
Circuit modules with front-side interposer terminals and through-module thermal dissipation structures
Low, Boon Yew, Tan, Lan Chu, Santos, Fernando A, Lim, Fui Yee, Li, Li
Year of Publication 14.02.2023
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Year of Publication 14.02.2023
Patent
CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MODULE THERMAL DISSIPATION STRUCTURES
Low, Boon Yew, Tan, Lan Chu, Santos, Fernando A, Lim, Fui Yee, Li, Li
Year of Publication 06.07.2022
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Year of Publication 06.07.2022
Patent
CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MODULE THERMAL DISSIPATION STRUCTURES
Low, Boon Yew, Tan, Lan Chu, Santos, Fernando A, Lim, Fui Yee, Li, Li
Year of Publication 30.06.2022
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Year of Publication 30.06.2022
Patent
Japan and Asian Values: A Challenge for Japan's East Asian Policy in theNew Century
Furuoka, Fumitaka, Yee, Beatrice Lim Fui, Mahmud, Roslinah
Published in Journal of contemporary Eastern Asia (30.09.2006)
Published in Journal of contemporary Eastern Asia (30.09.2006)
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Journal Article