A SiGe BiCMOS Transmitter/Receiver Chipset With On-Chip SIW Antennas for Terahertz Applications
Sanming Hu, Yong-Zhong Xiong, Bo Zhang, Lei Wang, Teck-Guan Lim, Minkyu Je, Madihian, M.
Published in IEEE journal of solid-state circuits (01.11.2012)
Published in IEEE journal of solid-state circuits (01.11.2012)
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Journal Article
Conference Proceeding
77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing
Sun, Mei, Guan Lim, Teck, Soon Wee Ho, David, Wu, Jiaqi, Chai, Tai Chong, Ma, Yugang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
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Journal Article
135-GHz Micromachined On-Chip Antenna and Antenna Array
Chu, Hui, Guo, Yong-Xin, Lim, Teck-Guan, Khoo, Yee Mong, Shi, Xiangquan
Published in IEEE transactions on antennas and propagation (01.10.2012)
Published in IEEE transactions on antennas and propagation (01.10.2012)
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Journal Article
Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
Li, Rui, Jin, Cheng, Ong, Siong Chiew, Lim, Teck Guan, Chang, Ka Fai, Ho, Soon Wee
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2013)
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Journal Article
TSV Technology for Millimeter-Wave and Terahertz Design and Applications
Hu, Sanming, Wang, Lei, Xiong, Yong-Zhong, Lim, Teck Guan, Zhang, Bo, Shi, Jinglin, Yuan, Xiaojun
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
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Journal Article
High Density TSV-Free Interposer (TFI) Packaging with Submicron Cu Damascene RDLs for Integration of CPU/GPU and HBM
Kawano, Masaya, Chum-Mei Wang, Hong-Yu Li, Mian-Zhi Ding, Lim, Sharon Pei-Siang, Teck-Guan Lim, Zi-Hao Chen, Fa-Xing Che
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Characterization of FOWLP Antenna in Packages
Mei, Sun, Guan, Lim Teck, Lin, Zhou
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit
Wai, Leong Ching, Guan Lim, Teck, Chong, Ser Choong, Zhou, Lin
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Characterization of 224 Gbps/lambda Interconnects in Co-Packaged Optics for Hyperscale Data Centers and AI/ML Clusters
Wu, Jiaqi, Lim, Teck Guan, Gourikutty, Sajay Bhuvanendran Nair, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement
Jiaqi, Wu, Guan, Lim Teck, Tsung-Yang Liow, Jason, Nair Gourikutty, Sajay Bhuvanendran
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding